Abstract: The invention relates to a method for producing a lens element (2), in particular for illumination purposes, in particular for producing a headlight lens (2) for a vehicle headlight, in particular for a motor vehicle headlight (1).

Abstract: A changeover apparatus for changing between workpiece supports for a machining machine. The changeover apparatus has a base frame with a carrier apparatus for the workpiece supports, which are vertically movable by the carrier apparatus, with the result that one of the workpiece supports can be transferred into a working plane in which the workpiece support is moved from the carrier apparatus into the machining machine and guided out therefrom. A lifting apparatus acts between the base frame and the carrier apparatus and by way of which the carrier apparatus can be vertically moved relative to the base frame for one workpiece support to take up a first lifting position or a further lifting position in the working plane. The lifting apparatus contains a slotted guide, which movably actuates the carrier apparatus with the workpiece supports together between the first lifting position and the further lifting position.

Abstract: The invention relates to a method for producing a lens element (2), in particular for illumination purposes, in particular for producing a headlight lens (2) for a vehicle headlight, in particular for a motor vehicle headlight (1).

Abstract: The invention relates to a force module (20) for generating forces in a highly dynamic manner by assembling a plurality of piezo actuators (1) for connecting to a voltage source. To enable the force module (20) to generate forces in the range of a few 100 kN in a highly dynamic and spatially resolved manner, according to the invention it is proposed that the force module (20) consists of at least two sub-modules (21), each having at least two piezo actuators (1) and their electrical contacting elements, and a controlling and protection module (16) for the piezo actuators (1) in the sub-modules (21), wherein all electric contacting elements of the sub-modules (21) are fed into the controlling and protection module (16).

Abstract: The invention relates to a force module (20) for generating forces in a highly dynamic manner by assembling a plurality of piezo actuators (1) for connecting to a voltage source. To enable the force module (20) to generate forces in the range of a few 100 kN in a highly dynamic and spatially resolved manner, according to the invention it is proposed that the force module (20) consists of at least two sub-modules (21), each having at least two piezo actuators (1) and their electrical contacting elements, and a controlling and protection module (16) for the piezo actuators (1) in the sub-modules (21), wherein all electric contacting elements of the sub-modules (21) are fed into the controlling and protection module (16).

Abstract: A shaft sealing ring comprising an annular holder (3) and an annular sealing section consisting of a sealing lip (4) extending to the surface (1) of the shaft against the pressure difference to be sealed and a radially extending connecting section (15) connecting the sealing tip (4) to the holder (3). The sealing tip (4) and the connecting section (15) are dimensioned so that their flexions to be expected under the pressure difference to be sealed exert a contrary affect upon the angle at which the sealing ring (4) is seated on the surface (1) of the shaft. This is made possible by the fact that at least one part (8) of the connection section (15) which is closer to the shaft surface (1) than another part (7) of the connection section (15) is deformed further towards the low-pressure side (PN) under the pressure difference to be sealed than the other part (7) of the connecting section.

Abstract: A high performance, wafer-shaped semiconductor device of the type including a wafer-shaped semiconductor element, a pair of electrodes located on the surfaces of the element, a pair of cylindrical metal bodies contacting the electrodes, an insulating ring enclosing and centering the metal bodies and the semiconductor element and a plastic jacket surrounding the insulating ring for tightly encasing the semiconductor device. In addition, there is provided a pair of annular sheet metal strips each of which has an inner edge region fastened to one of the cylindrical metal bodies and a corrugated chemically roughened outer edge region which is embedded in the plastic jacket. A powder coating is applied to the chemically roughened outer edge region for the purpose of providing a pressure and oil-tight housing for the semiconductor device.

Abstract: A printing apparatus for multiple signal printout has separate multiplexers for analog and pulse channels. The multiplexed analog signal is digitized, formatted, and applied via a selector to an adder, alternatively and selectively, the pulses are applied as digital signals to the adder. The adder receives zero offset numbers which differ for the different channels and the resultant numbers are applied to a one-out-of-n decoder driving printing electrodes. The system is under control of a cyclically addressed ROM whose outputs controls the multiplexing and furnishes the offset numbers. A clock sequencer times each acquisition frame.