Abstract: A method for constructing an electrical circuit that includes at least one semiconductor chip encapsulated with a potting compound is disclosed. The method includes applying a galvanic layer arrangement for forming an electrochemical element on an element of the electrical circuit including the at least one semiconductor chip.

Abstract: A device for cleaning the mouth or teeth has a rod-shaped support, on one axial end of which an interdental cleaner made of a flexible plastic is arranged. A brush-like cleaning part made of a flexible plastic, and having a plurality of protruding cleaning elements, is arranged at the opposite axial end of the rod-shaped support. In addition, the rod-shaped support has a grip portion made of a flexible plastic and arranged preferably in the central area of the axial length of the rod-shaped support. Provision is made that the grip portion is connected, via at least one connecting portion, to the interdental cleaner and/or to the brush-like cleaning part so as to form a one-piece structure.

Abstract: A method for constructing an electrical circuit that includes at least one semiconductor chip encapsulated with a potting compound is disclosed. The method includes applying a galvanic layer arrangement for forming an electrochemical element on an element of the electrical circuit including the at least one semiconductor chip.

Abstract: A method for producing an electrical circuit having at least one semiconductor chip is disclosed. The method includes forming a wiring layer at a contact side of the at least one semiconductor chip, which is encapsulated with a potting compound apart from the contact side. The wiring layer has at least one conductor loop for the purpose of forming an electrical coil.

Abstract: A multi-beam phase-array antenna device includes beam configuring devices (BFN) arranged in respective separate groups behind corresponding radiator elements (SE1 . . . SEm). In each group the beam configuring devices (BFN) are arranged one after the other along a first predetermined direction behind the associated radiator element. The number of beam configuring devices in each separate group is selected according to the number (n) of antenna signals. A signal combining device (SK) is provided for each separate group of beam forming devices (BFN). Signal distributing devices (VR1 . . . VRn) for control of the beam configuring devices are preferably mounted on the rear side of a circuit-carrying substrate (SU) for the beam configuring devices (BFN), in order to provide a compact structure. An especially compact and economical structure is provided when the transverse cross-section of each group is adjusted to the area of the associated radiator element.