Abstract: The invention relates to a device for catching a plurality of slices to be detached from a holding element, having a frame, a holder, attached to the frame, for accommodating the holding element holding the slices, at least two guiding elements on the sides and at least one bottom catching element, the guiding elements on the sides each being arranged on the frame in pairs on the right and the left.

Abstract: The invention relates to a device for manufacturing semiconductor material wafers with a sawing device for the sawing of slices attached to a saw holder, a pre-cleaning device arranged in the process direction downstream of the sawing device for pre-cleaning the surfaces of the slices hanging on the saw holder, and a degluing device arranged downstream in the process direction for detaching the slices from the saw holder.

Abstract: The invention relates to an apparatus for the separating of stacked plate-shaped elements. It is the object of the invention to provide possibilities with which stacked plate-shaped elements, in particular plate-shaped elements prone to breakage, can be reliably separated in a short time and to increase the useful operating time of an apparatus. In the invention, a stack of plate-shaped elements is placed onto a lifting device with which a stepped raising in vertical stages takes place. A conveying device for plate-shaped elements is arranged above the stack, with at least one conveying element being fastened to a conveyor belt made in the form of a continuous conveyor or to at least one rotating roller at said conveying device. Conveying elements are made from an elastically deformable material and have at least one end face in the direction of the surfaces of plate-shaped elements to be separated.