Patents by Inventor Jürgen Finze

Jürgen Finze has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of making a circuitized substrate assembly with carrier having substrates therein
    Patent number: 6338194
    Abstract: A method of making an assembly comprised of several circuitized substrates, e.g., printed circuit boards, frictionally retained within a common carrier through the use of appropriate, paired locking means. The method is adapted for subsequent processing (e.g., electronic component attach) of the substrates while assuring substrate retention. Subsequently, the substrates can be readily separated (removed) from the carrier.
    Type: Grant
    Filed: January 3, 2000
    Date of Patent: January 15, 2002
    Assignee: International Business Machines Corporation
    Inventors: Gerhard Benz, Jürgen Finze, Manfred Walker