Abstract: The invention relates to a method and device (10) for forming winding elements, in particular hairpin winding elements, from a conductor piece (12).

Abstract: The invention relates to a device and a method for transferring conductor parts, in particular plug-in winding elements bent into a U-shape, also known as hairpins, into a desired arrangement.

Abstract: Modular gripping finger for arrangement on a movable gripper jaw of a gripping device, having at least two rigidly interconnected finger modules, the finger modules including one or more base modules for forming a geometric shape of the gripping finger and including an end module having a gripping surface, the end module including an electrical end module interface and at least one sensor which is or can be connected to the end module interface.

Abstract: A device (1) for automated connection of two components (25, 27) in joint region (29) is proposed. The device (1) has a rotating winding device, especially a circle-segment-like rotor (3), which is arranged to guide a cloth tape (23) along winding paths (26) and to create a wound joint connection in the joint region (29).

Abstract: A connector for electrically contacting arresters of electrochemical cells includes a base element having two opposing flat sides, one or more contacting elements arranged on at least one of the two fiat sides. The one or more contacting elements extend in a contacting direction transversely to the flat sides.

Abstract: A device (1) for automated connection of two components (25, 27) in joint region (29) is proposed. The device (1) has a rotating winding device, especially a circle-segment-like rotor (3), which is arranged to guide a cloth tape (23) along winding paths (26) and to create a wound joint connection in the joint region (29).

Abstract: A probe station for testing semiconductor substrates, i.e., wafers and other electronic semiconductor elements, suitable for carrying out low-current and low-voltage measurement, comprises a shielding with which the electromagnetic influence (EMI) of the measurement of the semiconductor substrate can be minimized, and also comprises devices for the preparation of test signals. In addition, the housing of the probe station can offer a different possibility for the accessibility of individual components or component groups of the probe station.

Abstract: A wafer probe station is provided with a wafer chuck, a wafer fastened on the chuck by vacuum suction, and a probe needle arrangement above the wafer to test the wafer at high frequencies by contacting selected pads on the wafer and alternately pads on a calibration substrate also fastened on the wafer chuck. A procedure for reproduction of a calibration position of an aligned and afterwards displaced calibration substrate uses first and second measurement systems to calculate a new offset position of the calibration substrate after a second wafer is loaded on the wafer chuck. In a last step, the wafer chuck is driven by a 4axis manipulator stage to the new calibration position from the recent position.

Abstract: A wafer probe station is provided with a wafer chuck, a wafer fastened on the chuck by vacuum suction, and a probe needle arrangement above the wafer to test the wafer at high frequencies by contacting selected pads on the wafer and alternately pads on a calibration substrate also fastened on the wafer chuck. A procedure for reproduction of a calibration position of an aligned and afterwards displaced calibration substrate uses first and second measurement systems to calculate a new offset position of the calibration substrate after a second wafer is loaded on the wafer chuck. In a last step, the wafer chuck is driven by a 4axis manipulator stage to the new calibration position from the recent position.

Abstract: A method of contacting a contact area with the tip of a contact needle (contact tip) in a prober and the arrangement of such a prober, is based on the object of ensuring reliable contacting and direct observation of the establishment of the contact between the contact tip and the contact area when contacting contact pads of small dimensions. The prober substantially includes a base frame with a movement device including a clamping fixture for receiving a semiconductor wafer and also contact needles, which are arranged opposite the free surface of the semiconductor wafer. The contacting of the contact tips initially requires a horizontal positioning of the semiconductor wafer, so that the contact area and the contact tip are one above the other and at a distance from each other, and subsequently moving vertically in the direction of the contact tip, until a contact of the contact tips with the contact area is established.