Patents by Inventor Jürgen Freytag

Jürgen Freytag has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Fuse with a thermomechanical compensation element
    Patent number: 10431411
    Abstract: The invention relates to a melting fuse, especially for a motor vehicle that has a high-voltage circuit, comprising an electrically insulating housing inside of which there is a fusible conductor that connects two contacts with each other, whereby, between two longitudinal areas that are adjacent to each other, the fusible conductor has a rotation point around which the longitudinal areas can be rotated in case of a thermo-mechanical expansion.
    Type: Grant
    Filed: November 14, 2013
    Date of Patent: October 1, 2019
    Assignee: PACIFIC ENGINEERING CORPORATION
    Inventors: Pedro Fernández, Jürgen Freytag, Sascha Schulte, Akihiko Shimizu, Hartung Wilstermann
  • FUSE WITH A THERMOMECHANICAL COMPENSATION ELEMENT
    Publication number: 20150294829
    Abstract: The invention relates to a melting fuse, especially for a motor vehicle that has a high-voltage circuit, comprising an electrically insulating housing inside of which there is a fusible conductor that connects two contacts with each other, whereby, between two longitudinal areas that are adjacent to each other, the fusible conductor has a rotation point around which the longitudinal areas can be rotated in case of a thermo-mechanical expansion.
    Type: Application
    Filed: November 14, 2013
    Publication date: October 15, 2015
    Applicant: Pacific Engineering Corporation
    Inventors: Pedro Fernández, Jürgen Freytag, Sascha Schulte, Akihiko Shimizu, Hartung Wilstermann
  • Component and method for production thereof
    Patent number: 6334567
    Abstract: The invention relates to a component and to a method for the production. The component is an electronic component with a micro electronic chip and a carrier which is produced by means of isothermal coagulation.
    Type: Grant
    Filed: April 28, 2000
    Date of Patent: January 1, 2002
    Assignees: DaimlerChrysler AG, Shanghai Institue of Metallurgy
    Inventors: Xiaoming Xie, Zhongzhe Shen, Jürgen Freytag, Frank Stubhan