Abstract: A mounting frame member is provided for framing and sealing a frameless window pane of an after-market motor vehicle tailgate intended to replace a tailgate having a different structure. The mounting frame member includes a mounting frame body mounted to the motor vehicle, the mounting frame body including an integrally formed sealing weatherstrip at an inner peripheral region thereof. A supplemental sealing weatherstrip may be provided adjacent the sealing weatherstrip of the mounting frame body and over the frameless window pane. Accordingly, a single, unitary BIW structure may be utilized when effectuating after-market structural changes or replacements to an existing tailgate.

Abstract: In a corrugating machine and a method of producing corrugated cardboard, provision is made for a marking device by means of which a color mark is applied by rubbing off a solid coloring agent, the color mark being detected by means of a detection device in order to easily and precisely mark and cut out joining points. The applied and detected color mark enables a web length of a web of single-faced corrugated cardboard in a storage device to be determined, thus allowing an electronic control device to operate a cross-cutting device in an easy and precise manner.

Abstract: A mounting frame member is provided for framing and sealing a frameless window pane of an after-market motor vehicle tailgate intended to replace a tailgate having a different structure. The mounting frame member includes a mounting frame body mounted to the motor vehicle, the mounting frame body including an integrally formed sealing weatherstrip at an inner peripheral region thereof. A supplemental sealing weatherstrip may be provided adjacent the sealing weatherstrip of the mounting frame body and over the frameless window pane. Accordingly, a single, unitary BIW structure may be utilized when effectuating after-market structural changes or replacements to an existing tailgate.

Abstract: In a corrugating machine and a method of producing corrugated cardboard, provision is made for a marking device by means of which a color mark is applied by rubbing off a solid coloring agent, the color mark being detected by means of a detection device in order to easily and precisely mark and cut out joining points. The applied and detected color mark enables a web length of a web of single-faced corrugated cardboard in a storage device to be determined, thus allowing an electronic control device to operate a cross-cutting device in an easy and precise manner.

Abstract: Wastewater from a chemical-mechanical polishing process (CMP) used in semiconductor chip fabrication has hitherto been, and is still being, discharged into the public sewage system after chemical neutralization and sedimentation. This has the drawback that water consumption is considerable. It is therefore an object of the invention to reduce the total amount of wastewater produced that has to be discharged. This is achieved by the wastewater to be treated being subjected to an ultra-filtration, and at least one of NF an RO. This allows the treated CMP wastewater to be reused within the plant. In particular, it can be recycled in order again to recover therefrom deionized water of a very high purity for operational purposes, e.g. for CMP.

Abstract: Wastewater from a chemical-mechanical polishing process (CMP) used in semiconductor chip fabrication has hitherto been, and is still being, discharged into the public sewage system after chemical neutralization and sedimentation. This has the drawback that water consumption is considerable. It is therefore an object of the invention to reduce the total amount of wastewater produced that has to be discharged. This is achieved by the wastewater to be treated being subjected to an ultra-filtration. This allows the treated CMP wastewater to be reused within the plant. In particular, it can be recycled in order again to recover therefrom deionized water of a very high purity for operational purposes, e.g. for CMP.

Abstract: Wastewater from a chemical-mechanical polishing process (CMP) used in semiconductor chip fabrication has hitherto been, and is still being, discharged into the public sewage system after chemical neutralization and sedimentation. This has the drawback that water consumption is considerable. It is therefore an object of the invention to reduce the total amount of wastewater produced that has to be discharged. This is achieved by the wastewater to be treated being subjected to an ultra-filtration. This allows the treated CMP wastewater to be reused within the plant. In particular, it can be recycled in order again to recover therefrom deionized water of a very high purity for operational purposes, e.g. for CMP.