Abstract: The present invention relates to a process for preparing hydroxy-functionalized polydiene, preferably polybutadiene or polyisoprene, by reacting monomer diene with hydrogen peroxide in the presence of a hydrophilic organic solvent, wherein the total amount of monomer diene used is added to the reaction in at least two parts, wherein the second part of the monomer diene is added to the reaction at a temperature of the reaction mixture that is at least +5 K different from the temperature of the reaction mixture at the addition of the first part of the monomer diene, to hydroxy-functionalized polybutadiene, having a dispersity index D below 2.7, a viscosity at 30° C. below 3200 mPa*s, an OH-number of from 50 to 90, a number average molecular weight Mn of from 1.6 to 2.5 kDa, and a weight number average molecular weight Mw of from 4.0 to 5.

Abstract: A household dishwasher includes a first spray arm having a first spraying circle, a second spray arm having a second spraying circle which overlaps with the first spraying circle, and a synchronization facility configured to adapt a rotational speed of the first spray arm to a rotational speed of the second spray arm, or vice versa. The synchronization facility includes a first magnetic field allocated to the first spray arm and a second magnetic field allocated to the second spray arm, with the first magnetic field and the second magnetic field having a same polarization, so that the first magnetic field and the second magnetic field repel one another during operation of the household dishwasher to thereby prevent contact between the first spray arm and the second spray arm during a rotational movement of the first spray arm and the second spray arm.

Abstract: A household dishwasher includes a first spray arm having a first spraying circle, a second spray arm having a second spraying circle which overlaps with the first spraying circle, and a synchronization facility configured to adapt a rotational speed of the first spray arm to a rotational speed of the second spray arm, or vice versa. The synchronization facility includes a first magnetic field allocated to the first spray arm and a second magnetic field allocated to the second spray arm, with the first magnetic field and the second magnetic field having a same polarization, so that the first magnetic field and the second magnetic field repel one another during operation of the household dishwasher to thereby prevent contact between the first spray arm and the second spray arm during a rotational movement of the first spray arm and the second spray arm.

Abstract: A wafer orientation sensor includes a laser source, a laser detector, and an evaluator. The laser source is configured to emit a laser beam in a direction of a wafer in an evaluation region of the wafer orientation sensor so that the laser beam is reflected at a main surface of the wafer resulting in a reflected laser beam. The laser detector is configured to receive the reflected laser beam at least when the wafer is within a tolerance range regarding the orientation of the wafer. The evaluator is configured to receive a beam reception information from the laser detector and to determine an orientation information based on the beam reception information.

Abstract: A process for polymerization of a diene is provided. The process comprises: a) reacting the diene with hydrogen peroxide in a hydrophilic organic solvent in the presence of water to obtain a polymerization reaction mixture; b) contacting the polymerization reaction mixture with water having a temperature of from 20 to 80° C. to form a mixture having an organic phase and an aqueous phase; c) removing unreacted gaseous diene from the water mixture obtained in b); d) separating the aqueous phase comprising the hydrophilic solvent from the organic phase of the water mixture; and e) distilling volatile materials from the separated organic phase from d) to obtain the polymerization product; wherein a temperature of the reaction a) is from 50-150° C.

Abstract: A wafer orientation sensor includes a laser source, a laser detector, and an evaluator. The laser source is configured to emit a laser beam in a direction of a wafer in an evaluation region of the wafer orientation sensor so that the laser beam is reflected at a main surface of the wafer resulting in a reflected laser beam. The laser detector is configured to receive the reflected laser beam at least when the wafer is within a tolerance range regarding the orientation of the wafer. The evaluator is configured to receive a beam reception information from the laser detector and to determine an orientation information based on the beam reception information.