Abstract: A new manufacturing method is described by the present invention for a new LED module 1. The method comprises mounting of at least one LED 3 onto a surface of a substrate 2, and depositing a base layer 5 to cover said substrate 2 surface and the LED 3, wherein the base layer 5 is transparent for visible light and preferably does not comprise phosphor particles. Optionally, a first heat treatment to modify the surface properties of the base layer 5 is comprised. The method further comprises dispensing a matrix material, so that it forms an essentially half-spherical cover covering the LED and optionally nearby portions of the base layer, and optionally, a second heat treatment to harden the half-spherical cover layer. Additionally the present invention discloses an LED module 1, which is manufactured by the claimed method.

Abstract: A packaging container, which can be made of plastic, for sliced foodstuffs, in particular cheese slices, with a bottom tray and a cover foil. The foodstuffs are introduced into the bottom tray of the packaging container. The bottom tray is then sealed by the cover foil, and then welded or adhesively bonded or otherwise attached to the bottom tray or to a border around the latter. The invention solves the problem that the consumer faces when foodstuffs are not easily removed from the packaging container. The bottom tray of this invention has recessed grips which allows easy removal of foodstuffs.