Patents by Inventor Jürgen Peter Turnsek

Jürgen Peter Turnsek has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6770377
    Abstract: The active brazing solder for brazing ceramic parts of alumina, particularly of high-purity alumina, contains a maximum of 12 wt. % Ti, a maximum of 8 wt. % Be, and less than 16.5 wt. % Fe, the remainder being Zr and any impurities that may be present. The active brazing solder has the following behaviour/features: Brazing temperature: lower than 1,000° C.; the brazed joint is high-vacuum-tight over a long period of time; the coefficient of thermal expansion of the active brazing alloy is substantially identical to that of the alumina ceramic in the entire temperature range covered during the brazing process; the strength of the brazed joint between the two ceramic parts is so high that under tensile loading, fracture will result not at the joint, but in the adjacent ceramic; the pressure resistance of the active brazing solder is greater than 2 GPa; the active brazing solder is very good processable into powders having particle sizes on the order of 10 &mgr;m.
    Type: Grant
    Filed: June 12, 2002
    Date of Patent: August 3, 2004
    Assignee: Endress + Hauser GmbH + Co.
    Inventors: Frank Hegner, Elke Maria Schmidt, Volker Güther, Anobecs Allo, Jürgen Breme, Heinz Müller, Jürgen Peter Turnsek
  • Patent number: 6427900
    Abstract: The active brazing solder for brazing ceramic parts of alumina, particularly of high-purity alumina, contains a maximum of 12 wt. % Ti, a maximum of 8 wt. % Be, and less than 16.5 wt. % Fe, the remainder being Zr and any impurities that may be present. The active brazing solder has the following behaviour/features: Brazing temperature: lower than 1,000° C.; the brazed joint is high-vacuum-tight over a long period of time; the coefficient of thermal expansion of the active brazing alloy is substantially identical to that of the alumina ceramic in the entire temperature range covered during the brazing process; the strength of the brazed joint between the two ceramic parts is so high that under tensile loading, fracture will result not at the joint, but in the adjacent ceramic; the pressure resistance of the active brazing solder is greater than 2 GPa; the active brazing solder is very good processable into powders having particle sizes on the order of 10 &mgr;m.
    Type: Grant
    Filed: December 7, 1999
    Date of Patent: August 6, 2002
    Assignee: Endress + Hauser GmbH + Co.
    Inventors: Frank Hegner, Elke Maria Schmidt, Volker Güther, Andreas Otto, Jürgen Breme, Heinz Müller, Jürgen Peter Turnsek