Abstract: A control module for a vehicle with at least one electric motor and a transmission is provided. The control module has a housing for receiving a transmission control electronics unit and an inverter electronics unit for controlling an electric motor, and a heat sink. The heat sink is disposed between a housing upper part and a housing lower part in such a manner that the heat sink forms part of the housing. The housing lower part and the heat sink form a medium-tight cavity for receiving the inverter electronics unit. The transmission control electronics unit is surrounded by a plastic casing. The transmission control electronics unit with the plastic casing forms the housing upper part. The housing upper part is connected to the heat sink in a thermally conductive manner such that a heat transport from the transmission control electronics unit to the heat sink takes place.

Abstract: A control module for a vehicle with at least one electric motor and a transmission is provided. The control module has a housing for receiving a transmission control electronics unit and an inverter electronics unit for controlling an electric motor, and a heat sink. The heat sink is disposed between a housing upper part and a housing lower part in such a manner that the heat sink forms part of the housing. The housing lower part and the heat sink form a medium-tight cavity for receiving the inverter electronics unit. The transmission control electronics unit, conjointly with the plastic casing and the base plate, forms the housing upper part. The housing upper part is connected to the heat sink in a thermally conductive manner such that a heat transport from the transmission control electronics unit via the base plate to the heat sink takes place.

Abstract: The disclosure provides a circuit board that includes: a carrier element having a number of circuit board layers; a number of electronic components; a number of thermal interfaces; and a number of electrical interfaces. The electronic components are arranged directly on at least one of the surface sides on the carrier element. The opposite surface side of the carrier element is of potential-free design. Additionally, the circuit board with the electronic components is overlaid by a covering material in such a way that the electronic components are mechanically stabilized and the thermal and/or electrical interfaces are free of the covering material.

Abstract: The disclosure provides a circuit board that includes: a carrier element having a number of circuit board layers; a number of electronic components; a number of thermal interfaces; and a number of electrical interfaces. The electronic components are arranged directly on at least one of the surface sides on the carrier element. The opposite surface side of the carrier element is of potential-free design. Additionally, the circuit board with the electronic components is overlaid by a covering material in such a way that the electronic components are mechanically stabilized and the thermal and/or electrical interfaces are free of the covering material.

Abstract: A circuit board has a plurality of circuit board layers that are arranged one over the other, and that each include an electrically insulating base material having a glass transition temperature greater than or equal to 170° C. The circuit board layers each further have at least one thermally conductive layer applied to the base material. Several vias extend through respective ones of the circuit board layers to connect thermally conductive layers of different circuit board layers, such that the vias and the thermally conductive layers form a thermally conductive bridge from a topmost circuit board layer to a bottommost circuit board layer.

Abstract: The invention relates to a circuit board (4) having a plurality of circuit board layers arranged one over the other. According to the invention, the circuit board layers are each made of a base material, the glass transition temperature of which is greater than or equal to 170° C., and the circuit board layers each have at least one thermally conductive layer (19 to 24) applied to the electrically insulating base material, wherein several vias (16, 17, 18) extending in a z-direction (z) perpendicularly to the circuit board layers are provided, which vias connect thermally conductive layers (19 to 24) of different circuit board layers in such a way that the vias (16, 17, 18) and the thermally conductive layers (19 to 24) of the circuit board layers form a thermally conductive bridge from a topmost circuit board layer to a bottommost circuit board layer. Furthermore, the invention relates to a control unit (1) for vehicle applications and to a use of the control unit (1).