Abstract: The present invention provides a mixture comprising at least three hardener components a1), a2), and b), the ratio of hardener component a1) to a2) being in the range from 0.1 to 10:1, and hardener component b) being present at 5% to 55% by weight, based on the mixture, a process for preparing this mixture, the use of the mixture of the invention for curing epoxy resins, the use of the mixture of the invention with epoxy resins as adhesives, and an epoxy resin cured with the mixture of the invention.

Abstract: The present invention provides a blend comprising one or more epoxy resins and a mixture which comprises 0.3 to 0.9 amine equivalent, per equivalent of epoxide of the epoxy resin used, of a hardener component a) and as hardener component b) a compound of the formula I, a process for preparing this blend, the use of the blend of the invention for producing cured epoxy resin, and an epoxy resin cured with the blend of the invention.

Abstract: The present invention provides a process for producing moldings, the curing of the mold being carried out using a blend comprising one or more epoxy resins and a mixture, the curing component a) being used within the mixture in the range from 0.3 to 0.9 amine equivalent per equivalent of epoxide of the epoxy resin used, and the hardener component b) being a compound of the formula I.

Abstract: The present invention provides a blend comprising one or more epoxy resins and a mixture which comprises 0.3 to 0.9 amine equivalent, per equivalent of epoxide of the epoxy resin used, of a hardener component a) and as hardener component b) a compound of the formula I, a process for preparing this blend, the use of the blend of the invention for producing cured epoxy resin, and an epoxy resin cured with the blend of the invention.

Abstract: The present invention provides a blend comprising one or more epoxy resins and a mixture which comprises 0.3 to 0.9 amine equivalent, per equivalent of epoxide of the epoxy resin used, of a hardener component a) and as hardener component b) a compound of the formula I, a process for preparing this blend, the use of the blend of the invention for producing cured epoxy resin, and an epoxy resin cured with the blend of the invention.

Abstract: The present invention provides a blend comprising one or more epoxy resins and a mixture which comprises 0.3 to 0.9 amine equivalent, per equivalent of epoxide of the epoxy resin used, of a hardener component a) and as hardener component b) a compound of the formula I, a process for preparing this blend, the use of the blend of the invention for producing cured epoxy resin, and an epoxy resin cured with the blend of the invention.

Abstract: The present invention provides a process for producing moldings, the curing of the mold being carried out using a blend comprising one or more epoxy resins and a mixture, the curing component a) being used within the mixture in the range from 0.3 to 0.9 amine equivalent per equivalent of epoxide of the epoxy resin used, and the hardener component b) being a compound of the formula I.

Abstract: The present invention provides a mixture comprising at least three hardener components a1), a2), and b), the ratio of hardener component a1) to a2) being in the range from 0.1 to 10:1, and hardener component b) being present at 5% to 55% by weight, based on the mixture, a process for preparing this mixture, the use of the mixture of the invention for curing epoxy resins, the use of the mixture of the invention with epoxy resins as adhesives, and an epoxy resin cured with the mixture of the invention.

Abstract: A curing agent for epoxy resins comprises: a) a reaction product of at least one polyalkylene polyether monoamine and/or polyamine with a polyepoxide and optionally, a monoepoxide to obtain an epoxide group-containing precursor, the precursor further reacted with a primary monoamine and/or a primary or secondary polyamine in at least a 10% molar excess relative to the epoxide groups of the precursor, the reaction product being substantially free of non-reacted amines; b) an amine-terminated adduct of an epoxy resin and a primary monoamine and/or a primary or secondary polyamine being substantially free of non-reacted amines; and c) an amine-terminated adduct of an epoxide group-containing reactive thinning agent and a primary monoamine and/or a primary or secondary polyamine being substantially free of non-reacted amines, and up to 50 mol % relative to the amino groups of a reactive thinning agent containing one or more epoxide groups per molecule.

Abstract: Novel cold-curing mixtures comprising epoxide compounds, curing agents, additives and optionally further auxiliary and filler materials, which have low irritant potential, which are free of solvents and are self-levelling and which, in the cured state, are colorfast and have a surface which, in terms of optical and tactile properties, is faultless.

Abstract: A curable mixture comprising at least one cyanate resin, at least one epoxide compound with more than one epoxy group per molecule, and a metal formula selected from the group consisting of MLxBy, M[SR]xBy, M[SR]x(N)y, M(PHal)m and M(PHal)m(N)n wherein M is a cation of a complexing metal, SR is an organic or inorganic acid residue, L is a chelating ligand, B is a Lewis base, PHal is an ion of a pseudohalide, N is a nitrogen base, x is an integer from 1 to 8, y is an integer from 1 to 5, z is an integer from 7 to 8, m is an integer from 2 to 3 and n is an integer from 1 to 2.