Abstract: An apparatus configured to sense presence and motion in a monitored space is presented. The apparatus includes a dual-element assembly with a first thermal sensing element and a second thermal sensing element configured to produce a direct current output that is sustained at a level substantially proportional to an amount of thermal energy being received at the thermal sensing elements. A lens array (or equivalent optics) is coupled to the elements, having a plurality of lenses directing incident thermal energy from a plurality of optically-defined spatial zones onto the sensing elements. An electronic circuitry is configured to read a resulting signal of the dual-element assembly and an individual output signal of each the first thermal sensing element and the second thermal sensing element.

Abstract: An apparatus configured to sense presence and motion in a monitored space includes one or more thermal sensing devices and a lens array. Each thermal sensing device is configured to produce a direct current output that is sustained at a level substantially proportional to an amount of thermal energy being received at the thermal sensing device. The lens array is coupled to the one or more thermal sensing devices and includes multiple lenses, each of which is configured to direct incident thermal energy from at least a respective one of multiple different physical zones located within the monitored space onto the one or more thermal sensing devices.

Abstract: An apparatus configured to sense presence and motion in a monitored space is presented. The apparatus includes a dual-element assembly with a first thermal sensing element and a second thermal sensing element configured to produce a direct current output that is sustained at a level substantially proportional to an amount of thermal energy being received at the thermal sensing elements. A lens array (or equivalent optics) is coupled to the elements, having a plurality of lenses directing incident thermal energy from a plurality of optically-defined spatial zones onto the sensing elements. An electronic circuitry is configured to read a resulting signal of the dual-element assembly and an individual output signal of each the first thermal sensing element and the second thermal sensing element.

Abstract: Systems and methods for recognizing a gesture made by a warm object are presented. The system includes a thermal sensor configured to generate a low frequency or direct current signal upon receiving thermal energy. A spatially modulating optic is disposed between the thermal sensor and the warm object. The optic is configured to modulate the thermal energy received by the thermal sensor as a function of an orientation of the warm object with respect to the thermal sensor. An electronics unit in communication with the thermal sensor includes a memory and a processor. The processor is configured by the memory to detect a change in the thermal sensor signal and recognize a characteristic of the thermal sensor signal.

Abstract: Systems and methods for recognizing a gesture made by a warm object are presented. The system includes a thermal sensor configured to generate a low frequency or direct current signal upon receiving thermal energy. A spatially modulating optic is disposed between the thermal sensor and the warm object. The optic is configured to modulate the thermal energy received by the thermal sensor as a function of an orientation of the warm object with respect to the thermal sensor. An electronics unit in communication with the thermal sensor includes a memory and a processor. The processor is configured by the memory to detect a change in the thermal sensor signal and recognize a characteristic of the thermal sensor signal.

Abstract: An apparatus configured to sense presence and motion in a monitored space includes one or more thermal sensing devices and a lens array. Each thermal sensing device is configured to produce a direct current output that is sustained at a level substantially proportional to an amount of thermal energy being received at the thermal sensing device. The lens array is coupled to the one or more thermal sensing devices and includes multiple lenses, each of which is configured to direct incident thermal energy from at least a respective one of multiple different physical zones located within the monitored space onto the one or more thermal sensing devices.

Abstract: A sensor for detecting electromagnetic radiation comprises a sensor element, a housing in which the sensor element is disposed, and a radiation inlet window provided in the housing and closed by a material transmissible for the radiation to be detected. The transmissible material is fixed to the housing by fixation means not disposed in the field of view of the sensor element.

Abstract: A sensor element for detecting electromagnetic radiation, particularly in the infrared range, comprises one or more heat-sensitive portions provided on a substrate and one or more influencing layers for influencing the absorption and/or reflection of the electromagnetic radiation to be detected. The heat-sensitive portion(s) and/or the influencing layers are arranged on the substrate in accordance with the thermal properties of the influencing layers, preferably asymmetrically.

Abstract: A method for correcting the output signal of a radiation sensor 20 includes obtaining two or more temperature signals from a corresponding number of measurements of quantities at different times and/or different locations relating to the temperature of the sensor, and correcting the output signal with reference to said temperature signals.

Abstract: A laminate leadless carrier package comprising an optoelectronic chip, a substrate supporting the chip, the substrate comprising a plurality of conductive and dielectric layers; a wire bond coupled to the optoelectronic chip and a wire bond pad positioned on the top surface of the substrate; an encapsulation covering the optoelectronic chip, the wire bond, and at least a portion of the top surface of the substrate, wherein the encapsulation is a molding compound; and wherein the package is arranged to be mounted as a side-looker. A process for manufacturing laminate leadless carrier packages, comprising preparing a substrate; applying epoxy adhesive to a die attach pad; mounting an optoelectronic chip on the die attach pad; wire-bonding the optoelectronic chip; molding a molding compound to form an encapsulation covering the optoelectronic chip, a wire bond, and the top surface of the substrate; and dicing the substrate into individual packages.

Abstract: A method for correcting the output signal of a radiation sensor 20 includes obtaining two or more temperature signals from a corresponding number of measurements of quantities at different times and/or different locations relating to the temperature of the sensor, and correcting the output signal with reference to said temperature signals.