Patents by Inventor J. Robert Young

J. Robert Young has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6514777
    Abstract: An improved bonding strip for a printed circuit to facilitate quality inspection. The bonding strip has functional regions and non-functional regions. A functional region is indicated by an area of the bonding strip having a first dimension in width. A non-functional region is indicated by an area of the bonding strip having a second dimension in width. The first dimension may be either wider or narrower than the second dimension.
    Type: Grant
    Filed: January 10, 2001
    Date of Patent: February 4, 2003
    Assignee: International Business Machines Corporation
    Inventors: Marshall L. Brown, James A. Busby, Raymond A. Phillips, Jr., John A. Potenza, Jirina D. Shupp, J. Robert Young
  • Publication number: 20010017765
    Abstract: An improved bonding strip for a printed circuit to facilitate quality inspection. The bonding strip has functional regions and non-functional regions. A functional region is indicated by an area of the bonding strip having a first dimension in width. A non-functional region is indicated by an area of the bonding strip having a second dimension in width. The first dimension may be either wider or narrower than the second dimension.
    Type: Application
    Filed: January 10, 2001
    Publication date: August 30, 2001
    Inventors: Marshall L. Brown, James A. Busby, Raymond A. Phillips, John A. Potenza, Jirina D. Shupp, J. Robert Young
  • Patent number: 6212077
    Abstract: An improved bonding strip for a printed circuit to facilitate quality inspection. The bonding strip has functional regions and non-functional regions. A functional region is indicated by an area of the bonding strip having a first dimension in width. A non-functional region is indicated by an area of the bonding strip having a second dimension in width. The first dimension may be either wider or narrower than the second dimension.
    Type: Grant
    Filed: January 25, 1999
    Date of Patent: April 3, 2001
    Assignee: International Business Machines Corporation
    Inventors: Marshall L. Brown, James A. Busby, Raymond A. Phillips, Jr., John A. Potenza, Jirina D. Shupp, J. Robert Young
  • Patent number: 5565119
    Abstract: A laser head for simultaneously attaching solder balls to a carrier has at least one solder tip, with the number of solder tips being equal to the number of solder balls to be attached to the carrier. Each solder tip is heated by an optical fiber in thermal contact with the tip at one end of the fiber and coupled to a laser, preferably operating in the infrared wavelength range, at the other end of the fiber via a multiplexer coupling device. A spring is used in association with each solder tip to bias each solder tip to hold the carrier in contact with the solder balls. The tip absorbs the radiant energy as it exits the optical fiber, and the tip is heated. The laser and multiplexer permit precise control over the heat imparted to the tip, which in turn permits control of the amount of the solder ball that is reflowed.
    Type: Grant
    Filed: April 28, 1995
    Date of Patent: October 15, 1996
    Assignee: International Business Machines Corporation
    Inventors: John R. Behun, Pedro A. Chalco, Joseph Funari, J. Robert Young