Abstract: A method for releasing molecules (guest molecules) from the matrix formed by the structure of another molecule (host molecule) in a controllable manner has been invented. This method has many applications in science and industry. In addition, applications based on such molecular systems may revolutionize significant areas of medicine, in particular the treatment of cancer and of viral infection. Similar effects can also be obtained by controlled fragmentation of a source molecule, where the molecular fragments form the active principle.

Abstract: An acetylenic end-capping agent of the general formula ##STR1## wherein R.sup.1 and R.sup.2 can be the same or different and are selected from the group consisting of hydrogen, C11 to C4 alkyl, phenyl and substituted phenyl, and wherein R.sup.1 and R.sup.2 together with the carbon atom to which they are attached form a saturated 5- or 6-membered ring. This end-capping agent is substantially free of Pd and Cu.Also provided is a method for producing this end-capping agent and a method for producing acetylene terminated compounds.

Abstract: An acetylenic end-capping agent of the general formula ##STR1## wherein R.sup.1 and R.sup.2 can be the same or different and are selected from the group consisting of hydrogen, C11 to C4 alkyl, phenyl and substituted phenyl, and wherein R.sup.1 and R.sup.2 together with the carbon atom to which they are attached form a saturated 5- or 6-membered ring. This end-capping agent is substantially free of Pd and Cu.Also provided is a method for producing this end-capping agent and a method for producing acetylene terminated compounds.

Abstract: There are provided substituted p-benzidines of the formula ##STR1## wherein Ar is phenyl or phenoxyphenyl.

Abstract: There are provided polyisoimides having repeating units of the formula ##STR1## wherein R is selected from the group consisting of ##STR2## wherein Me is --CH.sub.3 and wherein X is ##STR3## The polyisoimides of the present invention are soluble in a variety of solvents, including DMAC, THF and the like.The polyisoimides of the present invention are used to produce cured resins having high strength and temperature characteristics as well as low void contents. Curing is effected by heating the polyisoimides at temperatures ranging from about 200.degree. C. to about 370.degree. C.

Abstract: There are provided substituted p-phenylene diamines of the formula ##STR1## wherein Ar is phenyl or phenoxyphenyl.