Patents by Inventor J. Ted DiBene

J. Ted DiBene has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Right-angle power interconnect electronic packaging assembly
    Patent number: 6845013
    Abstract: The assembly includes a mother board having a processor carrier having a processor attached thereto. A heat sink is thermally coupled to the processor carrier and is located on top of the carrier. A voltage regulating module board is electrically coupled to the processor carrier and is configured to be positioned adjacent to the heat sink and at substantially a right angle to the mother board.
    Type: Grant
    Filed: March 4, 2003
    Date of Patent: January 18, 2005
    Assignee: Incep Technologies, Inc.
    Inventors: David H. Hartke, J. Ted DiBene, II
  • Coaxial and linear power delivery devices
    Publication number: 20040043644
    Abstract: A method, apparatus, and article of manufacture for distributing power to electronic circuits. The apparatus can include one or more power arrays and one or more ground arrays. The power arrays and the ground arrays are located within a single housing. Some embodiments further distribute signals to the electronic circuits. The arrays can be arranged in a linear or coaxial configuration.
    Type: Application
    Filed: May 27, 2003
    Publication date: March 4, 2004
    Inventors: J. Ted DiBene, Edward J. Derian
  • Right-angle power interconnect electronic packaging assembly
    Publication number: 20030181075
    Abstract: The assembly includes a mother board having a processor carrier having a processor attached thereto. A heat sink is thermally coupled to the processor carrier and is located on top of the carrier. A voltage regulating module board is electrically coupled to the processor carrier and is configured to be positioned adjacent to the heat sink and at substantially a right angle to the mother board.
    Type: Application
    Filed: March 4, 2003
    Publication date: September 25, 2003
    Inventors: David H. Hartke, J. Ted DiBene