Patents by Inventor J. Ted DiBene, II

J. Ted DiBene, II has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Right-angle power interconnect electronic packaging assembly
    Patent number: 6845013
    Abstract: The assembly includes a mother board having a processor carrier having a processor attached thereto. A heat sink is thermally coupled to the processor carrier and is located on top of the carrier. A voltage regulating module board is electrically coupled to the processor carrier and is configured to be positioned adjacent to the heat sink and at substantially a right angle to the mother board.
    Type: Grant
    Filed: March 4, 2003
    Date of Patent: January 18, 2005
    Assignee: Incep Technologies, Inc.
    Inventors: David H. Hartke, J. Ted DiBene, II