Abstract: Embodiments of a multi-seller securitization structure include an issuer structured to receive at least one asset portion from each seller of a plurality of sellers, with each asset portion comprising an asset support pool of a total asset pool of the issuer. The issuer is structured to issue at least two tranches of financial instruments, wherein a first tranche includes at least one senior instrument, and a second tranche includes at least one subordinated instrument. The second tranche includes a plurality of subtranches, at least one of which is structured to be associated with at least one of the asset support pools. Also, the issuer is structured for making at least one make-whole payment in connection with at least one make-whole amount tracked by the issuer in association with at least one of the asset support pools.

Abstract: A memory arrangement is comprised of a plurality of memory chips, and address and control lines connected to the chips. In order to minimize the effect of interference of signals from the address lines on the control lines, the address lines coupled to a portion of the chips carry address signals in inverted form, as compared with the address signals applied to the remainder of the chips, whereby interference signals of opposite polarity are induced in the control lines and cancel each other.

Abstract: A flexible electromagnetic pulse shielding conduit for electrical conductors which is constructed of a backshell to which is secured a flexible, sheet material tube and an electrically conductive metallic braid. The braid is located about the tube with both the braid and the tube being secured to the backshell through the use of a metallic band which is shrunk concentrically through the technique of magnetic pulse forming which thereby makes a positive secure connection between the backshell, the braid and the tube. A rubber sleeve is located about the braid which is also secured to the backshell through the technique of magnetic pulse forming which shrinks a second metallic band. The second metallic band overlaps the first metallic band.