Patents by Inventor J. William Medlin

J. William Medlin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7340938
    Abstract: The invention provides hydrogen selective metal-insulator-semiconductor sensors which include a layer of hydrogen selective material. The hydrogen selective material can be polyimide layer having a thickness between 200 and 800 nm. Suitable polyimide materials include reaction products of benzophenone tetracarboxylic dianhydride 4,4-oxydianiline m-phenylene diamine and other structurally similar materials.
    Type: Grant
    Filed: February 24, 2006
    Date of Patent: March 11, 2008
    Assignees: The Regents of the University of Colorado, The United States of America as represented by The United States Department of Energy
    Inventors: Dongmei Li, J. William Medlin, Anthony H. McDaniel, Robert J. Bastasz