Patents by Inventor J-Wing Teh

J-Wing Teh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220337248
    Abstract: Systems, methods, and devices are provided for configurable die-to-die communication between dies of an integrated circuit system using a programmable routing bridge. Such an integrated circuit system may include a first die on a substrate, a second die on the substrate, and a programmable routing bridge embedded in the substrate. The programmable routing bridge may be mounted to the first die and the second die and is configurable to transfer data between selectable points of the first die and selectable points of the second die.
    Type: Application
    Filed: July 1, 2022
    Publication date: October 20, 2022
    Inventors: J-Wing Teh, Min Suet Lim, Lai Guan Tang, MD Altaf Hossain, Gregory Steinke
  • Patent number: 10943864
    Abstract: A device and method of utilizing a programmable redistribution die to redistribute the outputs of semiconductor dies. Integrated circuit packages using a programmable redistribution die are shown. Methods of creating a programmable redistribution die are shown.
    Type: Grant
    Filed: November 29, 2017
    Date of Patent: March 9, 2021
    Assignee: Intel Corporation
    Inventors: Eng Huat Goh, Min Suet Lim, J-Wing Teh, Bok Eng Cheah
  • Publication number: 20200083157
    Abstract: A device and method of utilizing a programmable redistribution die to redistribute the outputs of semiconductor dies. Integrated circuit packages using a programmable redistribution die are shown. Methods of creating a programmable redistribution die are shown.
    Type: Application
    Filed: November 29, 2017
    Publication date: March 12, 2020
    Inventors: Eng Huat Goh, Min Suet Lim, J-Wing Teh, Bok Eng Cheah