Patents by Inventor Ja-Ee Li

Ja-Ee Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flexible printed circuit and fabrication method thereof
    Patent number: 8344257
    Abstract: A flexible printed circuit and fabrication method thereof is provided. At least one signal wire is disposed on a plastic substrate. Two ground lines are disposed at both sides of the signal wire in parallel. A shielding layer is provided, contacting the plastic substrate to form a chamber, wherein the signal wire and ground lines are wrapped therein. A flexible dielectric layer is implemented between the signal wire and the shielding layer to provide electricity isolation.
    Type: Grant
    Filed: September 28, 2009
    Date of Patent: January 1, 2013
    Assignee: HTC Corporation
    Inventors: Chung-Lun Wu, Fu-An Chu, Ja-Ee Li
  • FLEXIBLE PRINTED CIRCUIT AND FABRICATION METHOD THEREOF
    Publication number: 20100314164
    Abstract: A flexible printed circuit and fabrication method thereof is provided. At least one signal wire is disposed on a plastic substrate. Two ground lines are disposed at both sides of the signal wire in parallel. A shielding layer is provided, contacting the plastic substrate to form a chamber, wherein the signal wire and ground lines are wrapped therein. A flexible dielectric layer is implemented between the signal wire and the shielding layer to provide electricity isolation.
    Type: Application
    Filed: September 28, 2009
    Publication date: December 16, 2010
    Inventors: Chung-Lun WU, Fu-An Chu, Ja-Ee Li