Abstract: An operating method of memory system may include: transmitting a write command from a memory controller to a memory module; transmitting write data corresponding to the write command from the memory controller to the memory module; generating compressed data by compressing the write data in the memory module; writing the compressed data to one or more memory devices in the memory module; and transmitting unused r Memory capacity information on the memory module to the memory controller from the memory module.

Abstract: Provided are a lead-free solder, a solder paste, and a semiconductor device, and more particularly, a lead-free solder that includes Cu in a range from about 0.1 wt % to about 0.8 wt %, Pd in a range from about 0.001 wt % to about 0.1 wt %, Al in a range from about 0.001 wt % to about 0.1 wt %, Si in a range from about 0.001 wt % to about 0.1 wt %, and Sn and inevitable impurities as remainder, a solder paste and a semiconductor device including the lead-free solder. The lead-free solder and the solder paste are environment-friendly and have a high high-temperature stability and high reliability.

Abstract: Provided are a lead-free solder, a solder paste, and a semiconductor device, and more particularly, a lead-free solder that includes Cu in a range from about 0.1 wt % to about 0.8 wt %, Pd in a range from about 0.001 wt % to about 0.1 wt %, Al in a range from about 0.001 wt % to about 0.1 wt %, Si in a range from about 0.001 wt % to about 0.1 wt %, and Sn and inevitable impurities as remainder, a solder paste and a semiconductor device including the lead-free solder. The lead-free solder and the solder paste are environment-friendly and have a high high-temperature stability and high reliability.

Abstract: An apparatus for recognizing and processing information of electronic parts includes a seating unit on which electronic parts are seated and aligned and a part information processing unit disposed adjacent to the seating unit. The part information processing unit is configured to align the electronic parts using the seating unit, recognize a recognition surface of the electronic parts, obtaining part information of the recognized surface, and store the obtained part information.

Abstract: An apparatus for recognizing and processing information of electronic parts includes a seating unit on which electronic parts are seated and aligned and a part information processing unit disposed adjacent to the seating unit. The part information processing unit is configured to align the electronic parts using the seating unit, recognize a recognition surface of the electronic parts, obtaining part information of the recognized surface, and store the obtained part information.

Abstract: An automatic wire bonder including a lead frame provided with N number of bonding sites, N being a positive integer; a window clamper for clamping the lead frame and for exposing M number of bonding sites, M being a positive integer; K number of cameras for obtaining images of dies and portions of the lead frame located in the exposed bonding sites, K being a positive integer; a microprocessor for calculating bonding points of the dies and the lead frame based on the obtained images; and a capillary for automatically wire bonding the chips based on the calculated bonding points. Each of the bonding sites has a die pad at a center portion thereof to attach a die and a number of leads at a peripheral portion of the bonding site. In the automatic wire bonder, the lead frame is fed into a space between the window clamp and the heater block by the M pitches at once in such a way that M numbers of bonding sites are aligned with the working areas.

Abstract: When high speed memory devices are tested using a tester having a lower operating frequency than the operational speed of the memory device, limit conditions for the tester signals are required to prevent the interference between the tester and device signals. The present invention provides the limit conditions for the shift and strobe signal. The strobe signal is delivered to comparators with a delivery delay time defining the dead time zone. The shift signal controls the data path of the device to and from a driver and a comparator. When the strobe signal is within the present test cycle, the shift signal of a read cycle must be activated at the same time or earlier than the activation time of the WE/ signal of the next write cycle and the shift signal of a write cycle must start at the same time or earlier than the activation time of the OE/ signal of the next read cycle. When the strobe signal is outside of the test cycle, the shift signal must meet prescribed maximum and minimum timing conditions.