Patents by Inventor Ja-Hyung Hau

Ja-Hyung Hau has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for polishing a copper layer and method for forming a wiring structure using copper
    Publication number: 20050148292
    Abstract: In a method and apparatus for polishing a Cu metal layer and a method for forming Cu metal wiring, Cu oxide created by a surface oxidation of a Cu metal layer is removed from the wafer. The Cu metal layer, in which Cu oxide is removed, is polished. By polishing the Cu metal layer using the above method, process failures, such as scratches, caused by the presence of remnants of Cu oxide during subsequent polishing can be prevented.
    Type: Application
    Filed: February 7, 2005
    Publication date: July 7, 2005
    Inventors: Ja-Hyung Hau, Sang-Rok Hah, Hong-Seong Son, Duk-Ho Hong, Byung-Lyul Park