Patents by Inventor Ja Koo

Ja Koo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8284500
    Abstract: An object of the invention is to provide a laser line-generator that generates a straight line with the both end portions as bright as the central portion, and a laser line-generator module that integrates the laser line-generator with a laser light source. A columnar transparent medium has an entrance boundary surface 10 for taking in laser light and an exit surface 20 for emitting the taken laser light linearly. At least one of the entrance boundary surface 10 and the exit surface 20 is composed of a curved surface, and a curve forming the curved surface includes two or more inflection points F.
    Type: Grant
    Filed: June 8, 2009
    Date of Patent: October 9, 2012
    Assignee: Ayase Co., Ltd.
    Inventors: Chiaki Kojima, Ja Koo, Hiroyuki Imai
  • Publication number: 20100309565
    Abstract: An object of the invention is to provide a laser line-generator that generates a straight line with the both end portions as bright as the central portion, and a laser line-generator module that integrates the laser line-generator with a laser light source. A columnar transparent medium has an entrance boundary surface 10 for taking in laser light and an exit surface 20 for emitting the taken laser light linearly. At least one of the entrance boundary surface 10 and the exit surface 20 is composed of a curved surface, and a curve forming the curved surface includes two or more inflection points F.
    Type: Application
    Filed: June 8, 2009
    Publication date: December 9, 2010
    Applicant: Ayase Co., Ltd
    Inventors: Chiaki Kojima, Ja Koo, Hiroyuki Imai
  • Publication number: 20070256321
    Abstract: Method for controlling a drying course of a laundry dryer including the steps of (a) starting a drying course by using high temperature drying air, and sensing dryness of a drying object periodically, (b) determining a dryness saturation time point at which the dryness sensed thus exceeds a preset reference value Q, (c) determining a load of the drying object according to the drying saturation time point T_sat, and (d) varying a drying algorithm depending on the load of the drying object determined thus, whereby preventing a small amount of laundry from sticking to a drum in a drying course by varying a control algorithm of the drying motor in a case an amount of the drying object is determined to be small accurately with reference to a saturation time point of an electrode sensor.
    Type: Application
    Filed: November 13, 2006
    Publication date: November 8, 2007
    Inventors: Sun Bae, Ja Koo, Jin Hu, Yang Kim
  • Publication number: 20070136643
    Abstract: A digital television (DTV) transmitter/receiver and a method of processing data in the DTV transmitter/receiver are disclosed. In the DTV transmitter, a pre-processor pre-processes the enhanced data by coding the enhanced data for forward error correction (FEC) and expanding the FEC-coded enhanced data. A data formatter generates enhanced data packets including the pre-processed enhanced data and inserts known data to at least one of the enhanced data packets. A first multiplexer multiplexes the enhanced data packets with main data packets including the main data. And, an RS encoder RS-codes the multiplexed main and enhanced data packets, the RS encoder adding systematic parity data to each main data packet and adding RS parity place holders to each enhanced data packet. Herein, the RS encoder may insert non-systematic RS parity data or null data into the RS parity place holders included in each enhanced data packet.
    Type: Application
    Filed: August 30, 2006
    Publication date: June 14, 2007
    Inventors: Kyung Kang, In Choi, Kook Kwak, Ja Koo, Kyung Shin, Yong Suh, Young Hong, Sung Hong
  • Publication number: 20070121681
    Abstract: A digital television (DTV) transmitter and a method of processing data in the DTV transmitter/receiver are disclosed. In the DTV transmitter, a pre-processor pre-processes the enhanced data by coding the enhanced data for forward error correction (FEC) and expanding the FEC-coded data. A packet formatter generates one or more groups of enhanced data packets, each enhanced data packet including the pre-processed enhanced data and known data, wherein the data formatter adds burst time information into each group of enhanced data packets. And, a packet multiplexer generates at least one burst of enhanced data by multiplexing the one or more groups of enhanced data packets with at least one main data packet including the main data, each burst of enhanced data including at least one group of enhanced data packets.
    Type: Application
    Filed: July 11, 2006
    Publication date: May 31, 2007
    Inventors: Kyung Kang, Kook Kwak, Ja Koo, Kyung Shin, Yong Suh, Young Hong, Sung Hong
  • Publication number: 20070101602
    Abstract: A drum washing machine and a clothes dryer equipped with a thermoelectric module are disclosed. The thermoelectric module includes a heat absorption side and a heat dissipation side which absorbs and dissipates heat at a junction between two dissimilar metals depending on direction of current flow through the junction. The heat absorption side is disposed at a hot air flowing passage. Accordingly, the drying apparatus can increase energy efficiency with minor structural modification and becomes environmentally friendly unlike a conventional drying apparatus using a heat pump.
    Type: Application
    Filed: November 2, 2006
    Publication date: May 10, 2007
    Applicant: LG Electronics Inc.
    Inventors: Sun Bae, Ja Koo, Jin Hu, Yang Kim
  • Publication number: 20070002545
    Abstract: Disclosed herein is a semiconductor package board, in which a copper pattern having a predetermined shape is formed on a dummy area, thus preventing the entire semiconductor package board from bending. The present invention is technically characterized in that the copper pattern includes a beam part, which is provided in the longitudinal direction of the semiconductor package board, and a rib part, which is provided in the lateral direction of the semiconductor package board.
    Type: Application
    Filed: June 30, 2006
    Publication date: January 4, 2007
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seung Cho, Han Kim, Ja Koo, Hyo Jung, Il Yoon
  • Publication number: 20060086596
    Abstract: The present invention provides an electroactive solid-state actuator, including a solid polymer electrolyte film having first and second main surfaces facing each other, and first and second conductive polymer layers infiltrated into the first and second main surfaces of the solid polymer electrolyte film. Further, a method of manufacturing the electroactive solid-state actuator is provided, the method including preparing a solid polymer film having first and second main surfaces facing each other, infiltrating a monomer of a conductive polymer into the first and second main surfaces of the solid polymer film, followed by polymerization, to form first and second conductive polymer layers, and immersing the solid polymer film into an ionic liquid or liquid electrolyte to be converted to an electrically conductive polymer.
    Type: Application
    Filed: March 15, 2005
    Publication date: April 27, 2006
    Applicants: Samsung Electro-Mechanics Co., Ltd., Sungkyunkwan University
    Inventors: Kwi Lee, Young Lee, Jae Nam, Hyouk Choi, Mi Cho, Ja Koo
  • Publication number: 20050200238
    Abstract: The present invention provides a dielectric polymer actuator and an inchworm robot using the same. The dielectric polymer actuator comprises a laminate-type actuating part and a frame. The laminate-type actuating part is provided with at least one dielectric polymer film which has first and second surfaces positioned opposite to each other and a side interposed between the first and second surfaces and which includes an incompressible dielectric polymer. First and second compliant electrodes are connected to the first and second surfaces. The frame is formed along the side of the dielectric polymer film so that prestrain applied to the dielectric polymer film is about zero. When a voltage is applied through the first and second compliant electrodes to the dielectric polymer film, the laminate-type actuating part is warped in any one direction of first and second surface directions.
    Type: Application
    Filed: March 10, 2005
    Publication date: September 15, 2005
    Applicants: Samsung Electro-Mechanics Co., Ltd., Sungkyunkwan University
    Inventors: Choong Park, Young Lee, Jae Nam, Hyouk Choi, Ja Koo, Kwang Jung
  • Publication number: 20050110163
    Abstract: A flip chip bonding method and substrate architecture are disclosed for enhancing bonding performance between a chip and a substrate by forming a bump on the chip or the substrate. The flip chip bonding method includes performing pretreatment of a wafer having chips, dicing, and obtaining the pretreated individual chip; performing pretreatment of a substrate; aligning the pads of the pretreated chip with the pads of the pretreated substrate, and bonding the chip and the substrate together by applying an ultrasonic wave and heat using a collet and simultaneously applying pressure. Post treatment is performed by filling or molding resin after bonding. The chip or the substrate is formed with a plated bump, a stud bump or a wedge bump. The stud bump or the wedge bump can be additionally formed on the plated bump.
    Type: Application
    Filed: October 13, 2004
    Publication date: May 26, 2005
    Inventors: Ja Koo, Hyoung Kim