Abstract: An integrated circuit structure in which a plurality of Schottky diodes and a capacitor are integrally formed. The integrated circuit structure includes a substrate including an N-type semiconductor doped with N-type impurities and a P-type semiconductor doped with P-type impurities; a first conductive layer laminated on the substrate so that the first conductive layer is electrically connected to the N-type semiconductor and the P-type semiconductor; a dielectric layer laminated on an upper surface of the first conductive layer; and a second conductive layer laminated on an upper surface of the dielectric layer so that the second conductive layer forms a capacitor together with the first conductive layer and the dielectric layer. Accordingly, when the integrated circuit structure is used in a rectification circuit, the size of an entire circuit can be reduced.

Abstract: A microwave transponder. The microwave transponder includes a conductive plate including an antenna, and a semiconductor chip disposed within a terminal gap located in a vicinity of a center of the conductive plate. A window of a predetermined shape is formed to extend from the terminal gap toward a side of the conductive plate. The perfect impedance matching is fulfilled even when the transponder is bent. Since the return loss of the electromagnetic power is reduced at least in a quarter through the impedance matching, the energy transferred to the transponder is maximized.

Abstract: In receiving information on an item by use of electromagnetic waves propagating from the item in which a radio frequency identification (RFID) chip is embedded, a portable handset requests the information on the item that is stored in the RFID chip to the RFID chip-embedded item, receives from the item the information on the item, and, if additional information is needed other than the received information, requests the additional information to a server storing the information on the item by using the received information.

Abstract: In a radio frequency identification (RF-ID) system and method of sending additional signals, the radio frequency identification (RF-ID) system includes a tag portion including a sensor, the tag portion for outputting a composite signal including additional data from the sensor and basic data necessary for certification, an antenna for receiving the composite signal output from the tag portion, and a RF-ID reader portion for retrieving the composite signal received from the antenna and for decoding the basic data and the additional data.

Abstract: An optical coupling device for coupling light to a core of an optical waveguide device. The optical coupling device is connected to the core of the optical waveguide device at a first end and convex at a second end opposite the first. The optical coupling device includes a waveguide connecting the first and second ends of the optical coupling device, for light transmission, and a cladding surrounding the waveguide.

Abstract: Provided are a method and apparatus for bonding an element, which has a transparency with respect to UV light, to a substrate. The method includes forming an aluminum layer on a surface of the substrate, disposing the element on the aluminum layer, and bonding the element to the aluminum layer by applying pressure on the element toward the aluminum layer and irradiating UV light on a bonding area between the element and the aluminum layer. The apparatus includes a holder, a pressurizing plate installed at the bottom of the holder to apply pressure on the element toward the substrate and formed of a material having a transparency to UV light, a UV light lamp which is installed in the inner space of the holder, and a collimating lens which is positioned between the UV light lamp and the pressurizing plate and collimates UV light emitted from the UV light lamp.

Abstract: A surface mounted device (SMD) package using coaxial cables includes a device mounting unit formed in the package for mounting a high frequency electronic device which transmits and receives high frequency signals, transmission lines electrically connected to the high frequency electronic device mounting unit, and the coaxial cables penetrating internal and external portions of the package and including internal lead wires which contact the transmission lines. The SMD package is formed to conveniently transfer high frequency signals without the signal transfer loss.