Abstract: The present invention relates to a method and an apparatus for manufacturing of a desired pattern of an electrically conducting, semiconducting or insulating material on a substrate. A patterned polymer ink film (22?) is produced out of a semi-dry polymer ink by bringing a three-dimensional relief pattern with a positive image of the desired pattern (25) temporarily into contact with the semi-dry polymer ink film (22) so that portions (22?) of the semi-dry polymer ink film (22) are transferred to the three-dimensional relief pattern (25). The patterned polymer ink film with the negative of the desired pattern (22?) has vertical sidewalls caused by fracturing of the semi-dry polymer ink film (22) with cohesion by the edges of the three-dimensional relief pattern (25) and adhesion between the second portions (22?) of the semi-dry polymer ink film (22) and the three-dimensional relief pattern (25).

Abstract: The invention concerns a method of removing encapsulating material from encapsulated particles deposited onto a substrate. According to the method, a substrate is used which is capable of facilitating said removal of encapsulating material. The particles may be nanoparticles. In particular, the substrate-facilitated removal may result in sintering of the particles. The invention provides a novel way of functionalizing electronic structures using particulate matter and for conveniently producing e.g. printed electronics devices.

Abstract: The present publication discloses an electronic code, comprising a substrate (105, 10) of essentially electrically non-conducting material,several electrically conducting code elements (108) formed on the substrate. In accordance with the invention at least one code element (101, 108) comprises an editable area (109), the conductance of which can be altered electrically.

Abstract: The invention concerns a method of removing encapsulating material from encapsulated particles deposited onto a substrate. According to the method, a substrate is used which is capable of facilitating said removal of encapsulating material. The particles may be nanoparticles. In particular, the substrate-facilitated removal may result in sintering of the particles. The invention provides a novel way of functionalizing electronic structures using particulate matter and for conveniently producing e.g. printed electronics devices.