Patents by Inventor Jaakko Salonen

Jaakko Salonen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Low temperature bump-bonding semiconductor imaging device
    Patent number: 5952646
    Abstract: A semiconductor imaging device, for use, for example, in medical diagnosis and non-destructive testing, includes a radiation detector semiconductor substrate and a readout substrate connected to the detector by means of low temperature solder bumps A low temperature solder is preferably a lead-tin based solder having a melting point below that of eutectic lead-tin solder. Preferred embodiments of such low temperature solder include bismuth based alloys such as, for example, the eutectic (52 wt-%Bi, 32 wt-%Pb, 16 wt-%Sn) alloy which has a melting point under 100.degree. C.
    Type: Grant
    Filed: November 12, 1997
    Date of Patent: September 14, 1999
    Assignee: Simage Oy
    Inventors: Konstantinos Evangelos Spartiotis, Jaakko Salonen