Abstract: Several different embodiments of a semiconductor device and a heat sink assembly and are described, as well as methods for forming the embodiments. Methods for coupling corresponding embodiments of the heat sink assembly and the semiconductor device to form an electronic apparatus are also described, wherein the electronic apparatus includes a compliant support for supporting a heat sink. The semiconductor device includes an integrated circuit (IC) mounted upon an upper surface of a substrate. In a first embodiment of the semiconductor device, the compliant support is positioned about an outer region of the upper surface of the substrate surrounding the IC. In a second embodiment of the heat sink assembly, the compliant support is attached to an outer region of an underside surface of the heat sink. The compliant support responds to a compressive first force by producing a spring-like second force which opposes the first force.