Patents by Inventor Jacek M. Knop

Jacek M. Knop has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Plating method
    Patent number: 8945362
    Abstract: Methods for depositing a metal or metal alloy on a substrate and articles made with the methods are described. The metal or metal alloy is deposited on the substrate electrolytically. The current is periodically interrupted during deposition to improve throwing power and reduce nodule formation on the metal or metal alloy deposit.
    Type: Grant
    Filed: January 12, 2009
    Date of Patent: February 3, 2015
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Jacek M. Knop, John G. Carter, Donald E. Cleary
  • Plating method
    Patent number: 7582199
    Abstract: Methods for depositing a metal or metal alloy on a substrate and articles made with the methods are described. The metal or metal alloy is deposited on the substrate electrolytically. The current is periodically interrupted during deposition to improve throwing power and reduce nodule formation on the metal or metal alloy deposit.
    Type: Grant
    Filed: April 26, 2005
    Date of Patent: September 1, 2009
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Jacek M. Knop, John G. Carter, Donald E. Cleary
  • Plating method
    Publication number: 20090188804
    Abstract: Methods for depositing a metal or metal alloy on a substrate and articles made with the methods are described. The metal or metal alloy is deposited on the substrate electrolytically. The current is periodically interrupted during deposition to improve throwing power and reduce nodule formation on the metal or metal alloy deposit.
    Type: Application
    Filed: January 12, 2009
    Publication date: July 30, 2009
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventors: Jacek M. Knop, John G. Carter, Donald E. Cleary
  • Cleaning composition
    Publication number: 20040112869
    Abstract: A composition composed of a persulfate, boric acid, a fluorine containing acid and an inorganic acid. Adjuvants also may be included in the composition. The composition may be employed as a microetch solution in the fabrication of microelectronic packages.
    Type: Application
    Filed: September 9, 2003
    Publication date: June 17, 2004
    Applicant: Shipley Company, L.L.C.
    Inventors: John G. Carter, Jack D. Fellman, Jacek M. Knop, Martin W. Bayes