Abstract: Described herein is an apparatus, for processing semiconductor components, includes support surfaces and flexible couplings. The support surfaces are parallel to a first direction and spaced apart from each other in a second direction, perpendicular to the first direction. Moreover, the support surfaces are translationally movable relative to each other in the second direction to increase a pitch between adjacent support surfaces from a first pitch to a second pitch. Each of the flexible couplings is between and fixed to respective adjacent ones of the support surfaces. The flexible couplings flex as the support surfaces translationally move relative to each other in the second direction.

Abstract: A process for slicing a row from an array of devices includes positioning an array such that a row physically interfaces with a conforming fence, applying a force to the fence to conform it to the mating face of the row, applying a vacuum force to the fence to secure it in conformal position with the row, and then slicing the row from the array. Applying the force to the fence to conform it to the row inhibits leakage associated with the vacuum force utilized to secure the fence with the row. A stronger hold of the row is provided, which can lead to more precise slicing of the row. A slicing tool includes a rotatable support that, in operation, is supported by an air bearing and hence is able to freely rotate to a position such that the fence conforms to a workpiece face.

Abstract: A process for machining a row of magnetic read-write head sliders involves setting, for the row of sliders, (a) a wedge angle that corresponds to an angle relative to the direction of the reader-writer offset (e.g., the y-axis) and (b) a read-write error correction process control that corresponds to a machining profile according to which the row is machined along the direction of the row (e.g., the x-axis). The row of sliders is then machined simultaneously according to the set wedge angle and the set read-write error correction control process, effectively providing multiple-axis machining control for varying reader and writer dimensional control along a row. Thus, a slider at one end of the row may be machined at a different angle, relative to the x-axis, than a slider at the opposite end of the row.

Abstract: Embodiments of the present invention generally relate to a blade for isolating devices within a wafer and the method of isolating. The blade has a core material, a cutting material disposed on the core material, and a plating material covering a portion of the core and cutting materials. The edge of the blade is not covered by the plating material. During operation, a portion of the plating material is removed to expose the underlying core and cutting materials based on the wearing of the core and cutting materials at the edge of the blade.

Abstract: A lapping plate has photolithographically defined patterns that are electroplated to produce lands with well-defined channels. By choosing a particular geometry, the retention force is significantly reduced over prior art options, while still retaining a high land area fraction. In some versions, the material is electroplated onto sufficiently thin substrates to allow conformation to a curved vacuum chuck. This configuration provides a very large reduction in retraction force when compared to smooth, flat lapping plates. In addition, the substrate used to form the lapping plate has reduced thickness, and a vacuum chuck is used to pull the thin, flat lapping plate against it to define the curvature. This allows the lapping plate to be charged by a flat charging ring. The substrate used is typically glass and has been sputter-metallized on both sides. The resist is then patterned, leaving an exposed pattern in the metallization on both sides.

Abstract: A lapping plate has photolithographically defined patterns that are electroplated to produce lands with well-defined channels. By choosing a particular geometry, the retention force is significantly reduced over prior art options, while still retaining a high land area fraction. In some versions, the material is electroplated onto sufficiently thin substrates to allow conformation to a curved vacuum chuck. This configuration provides a very large reduction in retraction force when compared to smooth, flat lapping plates. In addition, the substrate used to form the lapping plate has reduced thickness, and a vacuum chuck is used to pull the thin, flat lapping plate against it to define the curvature. This allows the lapping plate to be charged by a flat charging ring. The substrate used is typically glass and has been sputter-metallized on both sides. The resist is then patterned, leaving an exposed pattern in the metallization on both sides.