Abstract: A photosensitive assembly with a transparent layer and a method for manufacturing the same. The method includes the steps of: providing a wafer having a plurality of photosensitive chips, each photosensitive chip having a photosensitive region and a plurality of bonding pads formed at a periphery of the photosensitive region; providing a plurality of transparent layers on the photosensitive regions of the photosensitive chips, respectively; and cutting the wafer into photosensitive assemblies using a cutter. Thus, each photosensitive chip may receive optical signals passing through the transparent layer.

Abstract: A method for packaging image sensors of the invention includes the steps of: providing a substrate formed with a plurality of zones, traces, and first long-holes penetrating through the substrate at a periphery of each zone, the zones being separated by the first long-holes; providing a frame layer placed on the substrate, the frame layer being formed with slots at positions corresponding to the zones of the substrate, and with second long-holes at positions corresponding to the first long-holes of the substrate; placing a plurality of photosensitive chips in each of the zones of the substrate and within the slots, respectively; electrically connecting the plurality of photosensitive chips to the substrate; placing a plurality of transparent layers above the slots of the frame layer to cover the photosensitive chips, respectively; and cutting along the first long-holes of the substrate and the second long-holes of the frame layer to form a plurality of image sensors.

Abstract: The invention provides an image sensor including a substrate, a frame layer, a photosensitive chip, a plurality of wires, and a transparent layer. The substrate includes plural metal sheets, which are spaced apart and arranged in an alternating manner. Each of the metal sheets includes a first board and a second board positioned at different heights. The frame layer is formed around and under the substrate to form a cavity with the substrate. Each of the first boards has a top surface exposed from the frame layer while each of the second boards has a bottom surface, which is exposed from the frame layer and serves as contact points for signal outputs. The photosensitive chip is positioned within the cavity. The wires electrically connect the top surfaces of the first boards to the photosensitive chip. The transparent layer is placed on the frame layer to cover the photosensitive chip. According to the invention, the manufacturing cost can be effectively lowered and the production yield can be improved.

Abstract: A package structure for a photosensitive chip includes a substrate having an upper surface and a lower surface, and a frame layer having a first surface and a second surface. The frame layer is formed on the substrate by way of injection molding with the first surface contacting the upper surface. A cavity is formed between the substrate and the frame layer. The second surface is formed with a depression in which plural projections each having a suitable height are formed. The frame layer is formed directly on the substrate by way of injection molding. The package structure further includes a photosensitive chip arranged within the cavity, a plurality of wires for connecting the substrate to the photosensitive chip, and a transparent layer rested on the projections within the depression. Accordingly, the yield can be improved and the manufacturing processes can be facilitated.