Patents by Inventor Jacinta Aman Lim

Jacinta Aman Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • INTERCONNECT USING LIQUID METAL
    Publication number: 20090001576
    Abstract: A semiconductor package comprises a substrate that has a first protruding interconnect and a semiconductor die that has a second protruding interconnect that faces the first protruding interconnect. The package further comprises a spacer provided between the substrate and the die, wherein the spacer comprises a hole filled with liquid metal to couple the first protruding interconnect to the second protruding interconnect.
    Type: Application
    Filed: June 29, 2007
    Publication date: January 1, 2009
    Inventors: Surinder Tuli, Wayne Mulholland, Song-Hua Shi, Ioan Sauciuc, Patricia Brusso, Jacinta Aman Lim