Abstract: The present invention discloses systems and methods for defining a coupling region or regions for use with optical systems. An embodiment of the coupling region represents a region in which an optical parameter meets or exceeds a selected threshold value. Embodiments of the coupling region may be used for the alignment, characterization, qualification, or design of optical elements or optical assemblies.

Abstract: A cure oven comprises a sealable door and one or more pressure valves mounted inside for curing optical subcomponents that have been assembled using an adhesive. The cure oven comprises a chamber that can be configured to receive several hundreds of assembled optical subcomponents. The cure oven is further coupled to a computerized system via a drive motor. The computerized system initiates the heating and cooling sequences, and indicates whether the door can be opened, or must remain shut. The cure oven maintains a certain pressure inside the oven chamber consistent with a rise in temperature, allowing assembled optical subcomponents to be cured at a much higher rate than possible without disassembling, or being damaged.

Abstract: A system and method for aligning optical components based on coupled optical power and encircled flux is described. In one embodiment of the invention, coupled power and encircled flux is measured corresponding to multiple locations of a first optical component relative to a second optical element. The measured coupled power and encircled flux values are analyzed and an appropriate location of the first optical component relative to the second optical component is selected.

Abstract: The present invention discloses systems and methods for defining a coupling region or regions for use with optical systems. An embodiment of the coupling region represents a region in which an optical parameter meets or exceeds a selected threshold value. Embodiments of the coupling region may be used for the alignment, characterization, qualification, or design of optical elements or optical assemblies.

Abstract: A system and method for aligning optical components based on coupled optical power and encircled flux is described. In one embodiment of the invention, coupled power and encircled flux is measured corresponding to multiple locations of a first optical component relative to a second optical element. The measured coupled power and encircled flux values are analyzed and an appropriate location of the first optical component relative to the second optical component is selected.

Abstract: Methods and apparatus for alignment of TO cans with photodiodes on fiber-optic receptacles. The methods and apparatus make use of direct connections to photodiodes or connections to Received Signal Strength Indicator (RSSI) outputs to align TO cans in fiber-optic receptacles. An optical source, such as a laser diode, can be powered by a low-frequency or DC source. This optical source can direct light into the fiber-optic receptacle. The TO can is manipulated in a barrel of the fiber-optic receptacle. The current through the photodiode or the RSSI output is monitored to determine when light directed into the photodiode is at a maximum or above a predetermined threshold. The TO can is fixed in the barrel when the light directed into the photodiode is at the maximum or predetermined threshold.

Abstract: Methods and apparatus for alignment of TO cans with photodiodes on fiber-optic receptacles. The methods and apparatus make use of direct connections to photodiodes or connections to Received Signal Strength Indicator (RSSI) outputs to align TO cans in fiber-optic receptacles. An optical source, such as a laser diode, can be powered by a low-frequency or DC source. This optical source can direct light into the fiber-optic receptacle. The TO can is manipulated in a barrel of the fiber-optic receptacle. The current through the photodiode or the RSSI output is monitored to determine when light directed into the photodiode is at a maximum or above a predetermined threshold. The TO can is fixed in the barrel when the light directed into the photodiode is at the maximum or predetermined threshold.

Abstract: A cure oven comprises a sealable door and one or more pressure valves mounted inside for curing optical subcomponents that have been assembled using an adhesive. The cure oven comprises a chamber that can be configured to receive several hundreds of assembled optical subcomponents. The cure oven is further coupled to a computerized system via a drive motor. The computerized system initiates the heating and cooling sequences, and indicates whether the door can be opened, or must remain shut. The cure oven maintains a certain pressure inside the oven chamber consistent with a rise in temperature, allowing assembled optical subcomponents to be cured at a much higher rate than possible without disassembling, or being damaged.