Abstract: An alignment apparatus for use in sealing of a package lid to a base of an integrated circuit package. A fabrication boat for leadless chip carriers includes a plurality of arrays of upwardly extending fingers disposed to secure a base of a leadless chip carrier. An alignment member is slidably fit over the carrier base and the upwardly extending fingers. Each alignment member includes shoulders, each shoulder having a lower vertical surface in contact with the carrier base and having a horizontal surface resting upon the carrier base. Upper vertical surfaces of the shoulders are spaced apart to slidably receive a package lid for alignment with the base. The package lids are held within the alignment member primarily by gravitational force.