Patents by Inventor Jack Brian Steenstra

Jack Brian Steenstra has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10091918
    Abstract: Methods and apparatus for providing conformal shielding are disclosed to provide electromagnetic interference shielding of circuit components mounted on a circuit board. A print mold stencil is provided with one or more conductive shielding walls disposed within the stencil before its application to the circuit board and detachable therefrom, and also configured to encompass the circuit components. In this manner a shielded compartment volume is defined by walls of the print mold stencil and one or more of the conductive shielding walls, and may be easily and quickly applied to the circuit board to encompass the components for shielding. A conformal shielding layer is then formed from a molding material disposed in the shielded compartment volume that encompasses the components, as well as a conductive layer disposed on the outer surface of the material, and coupling of the shielding walls with a ground plane in the circuit board.
    Type: Grant
    Filed: September 26, 2013
    Date of Patent: October 2, 2018
    Assignee: QUALCOMM Incorporated
    Inventors: Yang Zhang, Jack Brian Steenstra
  • Patent number: 9936458
    Abstract: Techniques for managing battery power of a mobile device are described. In an aspect, battery power may be reserved for an application prior to execution of the application on the mobile device. The reservation may ensure that the application has sufficient battery power for execution. In another aspect, battery power may be allocated to applications based on their priorities. The applications may be ordered based on their priorities, and the available battery power for the mobile device may be allocated to one application at a time, starting with the highest priority application. In yet another aspect, battery power may be allocated to applications based on a battery discharge curve for the mobile device. An operating point on the battery discharge curve may be selected based on at least one objective. The available battery power may be determined based on the selected operating point and allocated to the applications.
    Type: Grant
    Filed: August 25, 2014
    Date of Patent: April 3, 2018
    Assignee: QUALCOMM Incorporated
    Inventors: Liren Chen, Kirk Steven Taylor, Jack Brian Steenstra
  • Publication number: 20140365790
    Abstract: Techniques for managing battery power of a mobile device are described. In an aspect, battery power may be reserved for an application prior to execution of the application on the mobile device. The reservation may ensure that the application has sufficient battery power for execution. In another aspect, battery power may be allocated to applications based on their priorities. The applications may be ordered based on their priorities, and the available battery power for the mobile device may be allocated to one application at a time, starting with the highest priority application. In yet another aspect, battery power may be allocated to applications based on a battery discharge curve for the mobile device. An operating point on the battery discharge curve may be selected based on at least one objective. The available battery power may be determined based on the selected operating point and allocated to the applications.
    Type: Application
    Filed: August 25, 2014
    Publication date: December 11, 2014
    Applicant: QUALCOMM Incorporated
    Inventors: Liren Chen, Kirk Steven Taylor, Jack Brian Steenstra
  • Publication number: 20140160699
    Abstract: Methods and apparatus for providing conformal shielding are disclosed to provide electromagnetic interference shielding of circuit components mounted on a circuit board. A print mold stencil is provided with one or more conductive shielding walls disposed within the stencil before its application to the circuit board and detachable therefrom, and also configured to encompass the circuit components. In this manner a shielded compartment volume is defined by walls of the print mold stencil and one or more of the conductive shielding walls, and may be easily and quickly applied to the circuit board to encompass the components for shielding. A conformal shielding layer is then formed from a molding material disposed in the shielded compartment volume that encompasses the components, as well as a conductive layer disposed on the outer surface of the material, and coupling of the shielding walls with a ground plane in the circuit board.
    Type: Application
    Filed: September 26, 2013
    Publication date: June 12, 2014
    Applicant: QUALCOMM Incorporated
    Inventors: Yang Zhang, Jack Brian Steenstra