Patents by Inventor Jack C. Smith

Jack C. Smith has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7026251
    Abstract: A method of providing a reticle layout for a die having at least three patterns, namely a right pattern, a center pattern, and a left pattern, where the center pattern is oversized relative to the photolithography step size. To avoid the non-uniformity effects resulting from stitching the center pattern, the center pattern size is minimized. This is accomplished by moving portions of the center pattern to the left and right patterns.
    Type: Grant
    Filed: December 12, 2002
    Date of Patent: April 11, 2006
    Assignee: Texas Instruments Incorporated
    Inventors: Jack C. Smith, James D. Huffman
  • Patent number: 6992375
    Abstract: An anchor to hold getter materials in place within a micromechanical device package substrate. First and second cavity faces define an anchor cavity and mechanically retain a getter away from a region holding the micromechanical device. The getter anchor may be formed in a substrate comprised of at least three layers. The layers form a cavity in the substrate with a wide bottom portion—formed in the middle layer and a relatively narrower top portion—formed by the top layer. The narrow portion helps to retain the getter in the cavity by creating a mechanical lock on the wide portion of getter in the bottom of the cavity.
    Type: Grant
    Filed: November 13, 2001
    Date of Patent: January 31, 2006
    Assignee: Texas Instruments Incorporated
    Inventors: Roger A. Robbins, Jwei Wien Liu, Jack C. Smith, Edward Carl Fisher, Joyce Wong Holton
  • Patent number: 6806993
    Abstract: The present invention provides, in one aspect, a method of manufacturing a MEMS assembly. In one embodiment, the method includes mounting a MEMS device, such as a MEMS mirror array, on an assembly substrate. The method further includes coupling an assembly lid to the assembly substrate and over the MEMS device to create an interior of the MEMS assembly housing the MEMS device, whereby the coupling maintains an opening to the interior of the MEMS assembly. Furthermore, the method includes lubricating/passivating the MEMS device through the opening. In addition, a MEMS assembly constructed according to a process of the present invention is also disclosed.
    Type: Grant
    Filed: June 4, 2003
    Date of Patent: October 19, 2004
    Assignee: Texas Instruments Incorporated
    Inventors: Lea Adams, Edward C. Fisher, Josh Malone, Seth Miller, Jack C. Smith, William Kevin Dennis, Jeffrey W. Marsh
  • Publication number: 20030108148
    Abstract: A method of providing a reticle layout for a die having at least three patterns, namely a right pattern, a center pattern, and a left pattern, where the center pattern is oversized relative to the photolithography step size. To avoid the non-uniformity effects resulting from stitching the center pattern, the center pattern size is minimized. This is accomplished by moving portions of the center pattern to the left and right patterns.
    Type: Application
    Filed: December 12, 2002
    Publication date: June 12, 2003
    Inventors: Jack C. Smith, James D. Huffman
  • Publication number: 20020063322
    Abstract: One embodiment provides an anchor to hold getter materials in place within a micromechanical device package substrate, said anchor comprising: a first cavity face; and a second cavity face. The cavity faces define an anchor cavity and mechanically retain a getter away from a region holding the micromechanical device. Another embodiment provides an anchor to hold a getter in place within a micromechanical device package. The anchor comprises: a package substrate; and a member attached to the package substrate, the member shaped to provide mechanical retention of the getter material formed over said member. Another embodiment provides a micromechanical device package comprising: a package substrate; a package lid enclosing a package cavity; a micromechanical device in the package cavity; and a getter anchor in the package cavity. Other embodiments provide methods of packaging and forming packages having a getter anchor. One getter anchor is formed in a substrate 906 comprised of at least three layers.
    Type: Application
    Filed: November 13, 2001
    Publication date: May 30, 2002
    Inventors: Roger A. Robbins, Jwei Wien Liu, Jack C. Smith, Edward Carl Fisher, Joyce Wong Holton
  • Patent number: 4158301
    Abstract: A method and apparatus for removing the coil set from a coiled roll of sheet metal material or the like, and which comprises a pair of cooperating rolls defining a nip through which the sheet metal is advanced, and a deflecting roll positioned immediately downstream of the nip to flex the advancing sheet material beyond its yield point and remove the coil set therefrom. Upon stopping of the advance to permit the cutting or other processing of the sheet material, the deflecting roll is automatically withdrawn from contact with the sheet material to thereby prevent the formation of a crease in the material, and upon restarting of the advance, the sheet material is initially reversely advanced a short distance to insure that any portion of the sheet material which has not been flexed to remove the coil set will be positioned upstream of the nip before the forward advance is commenced.
    Type: Grant
    Filed: September 26, 1977
    Date of Patent: June 19, 1979
    Inventor: Jack C. Smith