Abstract: A composite structure of thin films including alternating layers of relatively high conductivity metals and low conductivity metals to combine the effects of reflection and absorption and thereby maximize the attenuation of the structure. Additionally, a similar structure of layers of materials with differing magnetic permeabilities may be used for the same purpose.

Abstract: There is disclosed a new and improved gasless ion plating apparatus and process which eliminates the prior need for electrically isolating the substrate from the evacuated chamber in which the plating process is performed. In accordance with a disclosed embodiment, one or more substrates to be plated are placed within the chamber. Also within the chamber there is disposed a plating source which includes plating material. The chamber is evacuated and the plating material is heated to vaporize the plating material. Radio frequency energy is applied to the plating source to form a plasma of positively charged plating ions from the vaporized plating material. A positive direct current bias is developed on the plating source relative to the substrates by, for example, applying a direct current positive voltage to the plating source to create an electrical field between the source and substrates for accelerating the plating ions towards the substrates for plating the same.

Abstract: An improved fastener assembly system for grounding multiconductor, shielded cables. The assembly includes a saddle-shaped stud device and a preassembled nut and clamping washer. The clamping washer including a conical spring section and downwardly extending penetrating teeth to pierce the outer insulative sheath of the cable bringing the teeth into conductive contact with the metallic shield. The penetration of the teeth through the outer layer of elastomeric material eliminates the cold flow relaxation problems which could contribute to an ineffective grounding system.