Patents by Inventor Jack Chang-Chien
Jack Chang-Chien has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8878346Abstract: An integrated circuit, and a semiconductor die package formed therefrom, are disclosed including solder columns for adding structural support to the package during the fabrication process.Type: GrantFiled: April 28, 2006Date of Patent: November 4, 2014Assignee: SanDisk Technologies Inc.Inventors: Chin-Tien Chiu, Hem Takiar, Hui Liu, Jiang Hua Java Zhu, Jack Chang-Chien, Cheemen Yu
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Patent number: 8637972Abstract: A semiconductor die substrate panel is disclosed including a minimum kerf width between adjoining semiconductor package outlines on the panel, while ensuring electrical isolation of plated electrical terminals. By reducing the width of a boundary between adjoining package outlines, additional space is gained on a substrate panel for semiconductor packages.Type: GrantFiled: June 8, 2007Date of Patent: January 28, 2014Assignee: SanDisk Technologies Inc.Inventors: Chih-Chin Liao, Ning Ye, Cheemen Yu, Jack Chang Chien, Hem Takiar
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Patent number: 8499813Abstract: A system is disclosed for ejecting a semiconductor die from a tape to which the die is affixed during the wafer dicing process. In embodiments, the system includes an ejector tool including a support table, ejector pins and a pick-up arm. The support table is connected to a vacuum source for creating a negative pressure at an interface between the tape and support table. The support table further includes an aperture with one or more chamfered sidewalls. The vacuum source is connected to the aperture so that, upon placement of the tape on the support table with a die centered over the aperture, the vacuum source pulls a portion of the tape around the edges of the semiconductor die away from the die and into the space created by the chamfered edges.Type: GrantFiled: February 16, 2012Date of Patent: August 6, 2013Assignee: SanDisk Technologies Inc.Inventors: Jack Chang Chien, King Hoo Ong, Weili Wang, Li Wang, XingZhi Liang, Shicai Ma
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Patent number: 8482139Abstract: A flash memory card and methods of manufacturing same are disclosed. The card includes a semiconductor package fabricated to receive a single-sided or double-sided lid. A surface of the semiconductor package may be formed with holes, trenches and/or pockmarks. After the holes, trenches and/or pockmarks are formed, a lid may be attached to the package surface in an injection molding process. During the injection molding process, the molten plastic flows into the holes, trenches and/or pockmarks to interconnect with the surface of the semiconductor package. Thus, when the molten plastic hardens, the holes, trenches and/or pockmarks ensure that the lid remains firmly attached to semiconductor package.Type: GrantFiled: November 9, 2009Date of Patent: July 9, 2013Assignee: SanDisk Technologies Inc.Inventors: Che-Jung Chang, Chin-Tien Chiu, Cheeman Yu, Hem Takiar, Jack Chang Chien, Ning Liu
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Patent number: 8232145Abstract: A flash memory card and methods of manufacturing same are disclosed. The card includes a semiconductor package fabricated to receive a single-sided or double-sided lid. A surface of the semiconductor package may be formed with holes, trenches and/or pockmarks. After the holes, trenches and/or pockmarks are formed, a lid may be attached to the package surface in an injection molding process. During the injection molding process, the molten plastic flows into the holes, trenches and/or pockmarks to interconnect with the surface of the semiconductor package. Thus, when the molten plastic hardens, the holes, trenches and/or pockmarks ensure that the lid remains firmly attached to semiconductor package.Type: GrantFiled: November 9, 2009Date of Patent: July 31, 2012Assignee: SanDisk Technologies Inc.Inventors: Che-Jung Chang, Chin-Tien Chiu, Cheeman Yu, Hem Takiar, Jack Chang Chien, Ning Liu
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Patent number: 8212360Abstract: A semiconductor device having a redistribution layer, and methods of forming same, are disclosed. After fabrication of semiconductor die on a wafer, a tape assembly is applied onto a surface of the wafer, in contact with the surfaces of each semiconductor die on the wafer. The tape assembly includes a backgrind tape as a base layer, and a film assembly adhered to the backgrind tape. The film assembly in turn includes an adhesive film on which is deposited a thin layer of conductive material. The redistribution layer pattern is traced into the tape assembly, using for example a laser. Thereafter, the unheated portions of the tape assembly may be removed, leaving the heated redistribution layer pattern on each semiconductor die.Type: GrantFiled: May 9, 2011Date of Patent: July 3, 2012Assignee: SanDisk Technologies Inc.Inventors: Chien-Ko Liao, Chin-Tien Chiu, Jack Chang Chien, Cheemen Yu, Hem Takiar
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Publication number: 20120145332Abstract: A system is disclosed for ejecting a semiconductor die from a tape to which the die is affixed during the wafer dicing process. In embodiments, the system includes an ejector tool including a support table, ejector pins and a pick-up arm. The support table is connected to a vacuum source for creating a negative pressure at an interface between the tape and support table. The support table further includes an aperture with one or more chamfered sidewalls. The vacuum source is connected to the aperture so that, upon placement of the tape on the support table with a die centered over the aperture, the vacuum source pulls a portion of the tape around the edges of the semiconductor die away from the die and into the space created by the chamfered edges.Type: ApplicationFiled: February 16, 2012Publication date: June 14, 2012Inventors: Jack Chang Chien, KH Ong, Weili Wang, Li Wang, XingZhi Liang, Shicai Ma
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Publication number: 20110210446Abstract: A semiconductor device having a redistribution layer, and methods of forming same, are disclosed. After fabrication of semiconductor die on a wafer, a tape assembly is applied onto a surface of the wafer, in contact with the surfaces of each semiconductor die on the wafer. The tape assembly includes a backgrind tape as a base layer, and a film assembly adhered to the backgrind tape. The film assembly in turn includes an adhesive film on which is deposited a thin layer of conductive material. The redistribution layer pattern is traced into the tape assembly, using for example a laser. Thereafter, the unheated portions of the tape assembly may be removed, leaving the heated redistribution layer pattern on each semiconductor die.Type: ApplicationFiled: May 9, 2011Publication date: September 1, 2011Inventors: Chien-Ko Liao, Chin-Tien Chiu, Jack Chang Chien, Cheemen Yu, Hem Takiar
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Patent number: 7967184Abstract: A semiconductor package having a low profile is disclosed. In embodiments, a surface mounted component may be mounted directly to the core of the semiconductor package substrate, so that there is no conductive layer, plating layers or solder paste between the component and the substrate core. The surface mounted component may be any type of component which may be surface mounted on a substrate according to an SMT process, including for example passive components and various packaged semiconductors.Type: GrantFiled: November 16, 2005Date of Patent: June 28, 2011Assignee: SanDisk CorporationInventors: Chih-Chin Liao, Ken Jian Ming Wang, Han-Shiao Chen, Chin-Tien Chiu, Jack Chang Chien, Shrikar Bhagath, Cheemen Yu, Hem Takiar
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Patent number: 7952179Abstract: A portable memory card and methods of manufacturing same are disclosed. The portable memory includes a substrate having a plurality of holes formed therein. During the encapsulation process, mold compound flows over the top surface of the substrate, through the holes, and down into a recessed section formed in the bottom mold cap plate to form a projection of mold compound on the bottom surface of the substrate.Type: GrantFiled: June 28, 2007Date of Patent: May 31, 2011Assignee: SanDisk CorporationInventors: Chin-Tien Chiu, Hem Takiar, Chih-Chin Liao, Cheemen Yu, Ning Ye, Jack Chang Chien
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Patent number: 7939382Abstract: A portable memory card and methods of manufacturing same are disclosed. The portable memory includes a substrate having a plurality of holes formed therein. During the encapsulation process, mold compound flows over the top surface of the substrate, through the holes, and down into a recessed section formed in the bottom mold cap plate to form a projection of mold compound on the bottom surface of the substrate.Type: GrantFiled: June 28, 2007Date of Patent: May 10, 2011Assignee: SanDisk CorporationInventors: Chin-Tien Chiu, Hem Takiar, Chih-Chin Liao, Cheemen Yu, Ning Ye, Jack Chang Chien
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Patent number: 7939944Abstract: A semiconductor device having a redistribution layer, and methods of forming same, are disclosed. After fabrication of semiconductor die on a wafer, a tape assembly is applied onto a surface of the wafer, in contact with the surfaces of each semiconductor die on the wafer. The tape assembly includes a backgrind tape as a base layer, and a film assembly adhered to the backgrind tape. The film assembly in turn includes an adhesive film on which is deposited a thin layer of conductive material. The redistribution layer pattern is traced into the tape assembly, using for example a laser. Thereafter, the unheated portions of the tape assembly may be removed, leaving the heated redistribution layer pattern on each semiconductor die.Type: GrantFiled: July 26, 2010Date of Patent: May 10, 2011Assignee: SanDisk CorporationInventors: Chien-Ko Liao, Chin-Tien Chiu, Jack Chang Chien, Cheeman Yu, Hem Takiar
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Publication number: 20110084377Abstract: A system is disclosed for ejecting a semiconductor die from a tape to which the die is affixed during the wafer dicing process. In embodiments, the system includes an ejector tool including a support table, ejector pins and a pick-up arm. The support table is connected to a vacuum source for creating a negative pressure at an interface between the tape and support table. The support table further includes an aperture with one or more chamfered sidewalls. The vacuum source is connected to the aperture so that, upon placement of the tape on the support table with a die centered over the aperture, the vacuum source pulls a portion of the tape around the edges of the semiconductor die away from the die and into the space created by the chamfered edges.Type: ApplicationFiled: February 22, 2010Publication date: April 14, 2011Inventors: Jack Chang Chien, KH Ong, Weili Wang, Li Wang, XingZhi Liang, Shicai Ma
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Publication number: 20100289147Abstract: A semiconductor device having a redistribution layer, and methods of forming same, are disclosed. After fabrication of semiconductor die on a wafer, a tape assembly is applied onto a surface of the wafer, in contact with the surfaces of each semiconductor die on the wafer. The tape assembly includes a backgrind tape as a base layer, and a film assembly adhered to the backgrind tape. The film assembly in turn includes an adhesive film on which is deposited a thin layer of conductive material. The redistribution layer pattern is traced into the tape assembly, using for example a laser. Thereafter, the unheated portions of the tape assembly may be removed, leaving the heated redistribution layer pattern on each semiconductor die.Type: ApplicationFiled: July 26, 2010Publication date: November 18, 2010Inventors: Chien-Ko Liao, Chin-Tien Chiu, Jack Chang Chien, Cheemen Yu, Hem Takiar
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Patent number: 7772047Abstract: A semiconductor device having a redistribution layer, and methods of forming same, are disclosed. After fabrication of semiconductor die on a wafer, a tape assembly is applied onto a surface of the wafer, in contact with the surfaces of each semiconductor die on the wafer. The tape assembly includes a backgrind tape as a base layer, and a film assembly adhered to the backgrind tape. The film assembly in turn includes an adhesive film on which is deposited a thin layer of conductive material. The redistribution layer pattern is traced into the tape assembly, using for example a laser. Thereafter, the unheated portions of the tape assembly may be removed, leaving the heated redistribution layer pattern on each semiconductor die.Type: GrantFiled: June 28, 2007Date of Patent: August 10, 2010Assignee: SanDisk CorporationInventors: Chien-Ko Liao, Chin-Tien Chiu, Jack Chang Chien, Cheemen Yu, Hem Takiar
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Patent number: 7763980Abstract: A semiconductor device having a redistribution layer, and methods of forming same, are disclosed. After fabrication of semiconductor die on a wafer, a tape assembly is applied onto a surface of the wafer, in contact with the surfaces of each semiconductor die on the wafer. The tape assembly includes a backgrind tape as a base layer, and a film assembly adhered to the backgrind tape. The film assembly in turn includes an adhesive film on which is deposited a thin layer of conductive material. The redistribution layer pattern is traced into the tape assembly, using for example a laser. Thereafter, the unheated portions of the tape assembly may be removed, leaving the heated redistribution layer pattern on each semiconductor die.Type: GrantFiled: June 28, 2007Date of Patent: July 27, 2010Assignee: SanDisk CorporationInventors: Chien-Ko Liao, Chin-Tien Chiu, Jack Chang Chien, Cheemen Yu, Hem Takiar
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Publication number: 20100055847Abstract: A flash memory card and methods of manufacturing same are disclosed. The card includes a semiconductor package fabricated to receive a single-sided or double-sided lid. A surface of the semiconductor package may be formed with holes, trenches and/or pockmarks. After the holes, trenches and/or pockmarks are formed, a lid may be attached to the package surface in an injection molding process. During the injection molding process, the molten plastic flows into the holes, trenches and/or pockmarks to interconnect with the surface of the semiconductor package. Thus, when the molten plastic hardens, the holes, trenches and/or pockmarks ensure that the lid remains firmly attached to semiconductor package.Type: ApplicationFiled: November 9, 2009Publication date: March 4, 2010Inventors: Che-Jung Chang, Chin-Tien Chiu, Cheeman Yu, Hem Takiar, Jack Chang Chien, Ning Liu
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Publication number: 20100052155Abstract: A flash memory card and methods of manufacturing same are disclosed. The card includes a semiconductor package fabricated to receive a single-sided or double-sided lid. A surface of the semiconductor package may be formed with holes, trenches and/or pockmarks. After the holes, trenches and/or pockmarks are formed, a lid may be attached to the package surface in an injection molding process. During the injection molding process, the molten plastic flows into the holes, trenches and/or pockmarks to interconnect with the surface of the semiconductor package. Thus, when the molten plastic hardens, the holes, trenches and/or pockmarks ensure that the lid remains firmly attached to semiconductor package.Type: ApplicationFiled: November 9, 2009Publication date: March 4, 2010Inventors: Che-Jung Chang, Chin-Tien Chiu, Cheeman Yu, Hem Takiar, Jack Chang Chien, Ning Liu
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Patent number: 7615861Abstract: A flash memory card and methods of manufacturing same are disclosed. The card includes a semiconductor package fabricated to receive a single-sided or double-sided lid. A surface of the semiconductor package may be formed with holes, trenches and/or pockmarks. After the holes, trenches and/or pockmarks are formed, a lid may be attached to the package surface in an injection molding process. During the injection molding process, the molten plastic flows into the holes, trenches and/or pockmarks to interconnect with the surface of the semiconductor package. Thus, when the molten plastic hardens, the holes, trenches and/or pockmarks ensure that the lid remains firmly attached to semiconductor package.Type: GrantFiled: March 13, 2006Date of Patent: November 10, 2009Assignee: SanDisk CorporationInventors: Che-Jung Chang, Chin-Tien Chiu, Cheemen Yu, Hem Takiar, Jack Chang Chien, Ning Liu
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Patent number: 7611927Abstract: A semiconductor die substrate panel is disclosed including a minimum kerf width between adjoining semiconductor package outlines on the panel, while ensuring electrical isolation of plated electrical terminals. By reducing the width of a boundary between adjoining package outlines, additional space is gained on a substrate panel for semiconductor packages.Type: GrantFiled: June 8, 2007Date of Patent: November 3, 2009Assignee: SanDisk CorporationInventors: Chih-Chin Liao, Ning Ye, Cheemen Yu, Jack Chang Chien, Hem Takiar