Abstract: A modular workspace platform system for providing a mobile work surface for a user includes a workspace platform attachable to a location specified by the user. The workspace platform includes a compact work surface for use in performing at least one manual task including temporarily storing a material, mixing two or more materials, temporarily supporting a tool, and providing a tool cleaning surface. In an embodiment, the compact work surface includes at least one of a trough, a tapered channel, a tool insertion slot, a wipe holder, a textured surface configured as the tool cleaning surface, a mixing surface a ruler holder, and a matrix ring holder.

Abstract: A modular workspace platform system for providing a mobile work surface for a user includes a workspace platform attachable to a location specified by the user. The workspace platform includes a compact work surface for use in performing at least one manual task including temporarily storing a material, mixing two or more materials, temporarily supporting a tool, and providing a tool cleaning surface. In an embodiment, the compact work surface includes at least one of a trough, a tapered channel, a tool insertion slot, a wipe holder, a textured surface configured as the tool cleaning surface, a mixing surface a ruler holder, and a matrix ring holder.

Abstract: In a satellite gateway, data is transmitted over a downstream channel at different throughput rates. Data destined for each subscriber/receiver is assigned a throughput rate depending upon the downstream signal quality of that subscriber/receiver. The downstream data is parsed to extract data packets. The data packets are then loaded into packet queues based on an identifier within such packets. The queues represent a bandwidth efficiency or throughput rate that can be currently tolerated by specific subscribers that may also be based on the current signal quality at a subscriber location. The parsed data traffic is processed based on the profile of the plurality of profiles to produce processed data traffic, and transmitted from the packet queues over a downstream channel.

Abstract: In a satellite gateway, data is transmitted over a downstream channel at different throughput rates. Data destined for each subscriber/receiver is assigned a throughput rate depending upon the downstream signal quality of that subscriber/receiver. The downstream data is parsed to extract data packets. The data packets are then loaded into packet queues based on an identifier within such packets. The queues represent a bandwidth efficiency or throughput rate that can be currently tolerated by specific subscribers that may also be based on the current signal quality at a subscriber location. The parsed data traffic is processed based on the profile of the plurality of profiles to produce processed data traffic, and transmitted from the packet queues over a downstream channel.

Abstract: In a DOCSIS based satellite gateway data is transmitted over a single downstream channel, at different throughput rates. Data destined for each subscriber/receiver is assigned a throughput rate depending upon the downstream signal quality of that subscriber/receiver. To accomplish this, the downstream DOCSIS MAC data is parsed to extract DOCSIS packets. The DOCSIS packets are then loaded into packet queues based on an identifier within such packets such as the MAC destination address or SID. Each of the queues represents a bandwidth efficiency or throughput rate that can be currently tolerated by specific subscribers based on the current signal quality being experienced at the subscriber location. A PHY-MAP describing the downstream data structure to be transmitted and inserted into the downstream data. Data is extracted from the packet queues in queue blocks as defined by the PHY-MAP.

Abstract: In a DOCSIS based satellite gateway data is transmitted over a single downstream channel, at different throughput rates. Data destined for each subscriber/receiver is assigned a throughput rate depending upon the downstream signal quality of that subscriber/receiver. To accomplish this, the downstream DOCSIS MAC data is parsed to extract DOCSIS packets. The DOCSIS packets are then loaded into packet queues based on an identifier within such packets such as the MAC destination address or SID. Each of the queues represents a bandwidth efficiency or throughput rate that can be currently tolerated by specific subscribers based on the current signal quality being experienced at the subscriber location. A PHY-MAP describing the downstream data structure to be transmitted and inserted into the downstream data. Data is extracted from the packet queues in queue blocks as defined by the PHY-MAP.

Abstract: In a DOCSIS based satellite gateway data is transmitted over a single downstream channel, at different throughput rates. Data destined for each subscriber/receiver is assigned a throughput rate depending upon the downstream signal quality of that subscriber/receiver. To accomplish this, the downstream DOCSIS MAC data is parsed to extract DOCSIS packets. The DOCSIS packets are then loaded into packet queues based on an identifier within such packets such as the MAC destination address or SID. Each of the queues represents a bandwidth efficiency or throughput rate that can be currently tolerated by specific subscribers based on the current signal quality being experienced at the subscriber location. A PHY-MAP describing the downstream data structure to be transmitted and inserted into the downstream data. Data is extracted from the packet queues in queue blocks as defined by the PHY-MAP.

Abstract: An electronic component is disclosed including a plurality of semiconductor packages soldered together in a side-by-side configuration. The packages are batch processed on a substrate panel. The panel includes a plurality of through-holes drilled through the panel and subsequently filled with metal such as copper or gold. These filled through-holes lie along the cut line between adjacent packages so that, upon singulation, the filled through holes are cut and a portion of the filled through-holes are exposed at the side edges of the singulated packages. These exposed portions of the filled through-holes form vertical surface mount technology (SMT) pads. After the semiconductor packages are singulated and the SMT pads are defined in the side edges, SMT is used to solder the SMT pads of a first semiconductor package to the respective SMT pads of a second semiconductor package to structurally and electrically couple the two packages together side-by-side.

Abstract: A flash memory card and methods of manufacturing same are disclosed. The card includes a semiconductor package fabricated to receive a single-sided or double-sided lid. A surface of the semiconductor package may be formed with holes, trenches and/or pockmarks. After the holes, trenches and/or pockmarks are formed, a lid may be attached to the package surface in an injection molding process. During the injection molding process, the molten plastic flows into the holes, trenches and/or pockmarks to interconnect with the surface of the semiconductor package. Thus, when the molten plastic hardens, the holes, trenches and/or pockmarks ensure that the lid remains firmly attached to semiconductor package.

Abstract: An electronic component is disclosed including a plurality of semiconductor packages soldered together in a side-by-side configuration. The packages are batch processed on a substrate panel. The panel includes a plurality of through-holes drilled through the panel and subsequently filled with metal such as copper or gold. These filled through-holes lie along the cut line between adjacent packages so that, upon singulation, the filled through holes are cut and a portion of the filled through-holes are exposed at the side edges of the singulated packages. These exposed portions of the filled through-holes form vertical surface mount technology (SMT) pads. After the semiconductor packages are singulated and the SMT pads are defined in the side edges, SMT is used to solder the SMT pads of a first semiconductor package to the respective SMT pads of a second semiconductor package to structurally and electrically couple the two packages together side-by-side.

Abstract: A semiconductor package having a low profile is disclosed. In embodiments, a surface mounted component may be mounted directly to the core of the semiconductor package substrate, so that there is no conductive layer, plating layers or solder paste between the component and the substrate core. The surface mounted component may be any type of component which may be surface mounted on a substrate according to an SMT process, including for example passive components and various packaged semiconductors.

Abstract: A semiconductor die substrate is disclosed for preventing delamination of the die and/or die cracking due to air bubbles trapped beneath the die, and a semiconductor package incorporating the substrate. A solder mask may be laminated on a surface of the substrate which is patterned with one or more passageways, or canals, allowing air bubbles to be expelled from beneath the semiconductor die during the semiconductor package fabrication. The canals may have a variety of shapes, including for example a wavy, undulating shape.

Abstract: In a DOCSIS based satellite gateway data is transmitted over a single downstream channel, at different throughput rates. Data destined for each subscriber/receiver is assigned a throughput rate depending upon the downstream signal quality of that subscriber/receiver. To accomplish this, the downstream DOCSIS MAC data is parsed to extract DOCSIS packets. The DOCSIS packets are then loaded into packet queues based on an identifier within such packets such as the MAC destination address or SID. Each of the queues represents a bandwidth efficiency or throughput rate that can be currently tolerated by specific subscribers based on the current signal quality being experienced at the subscriber location. A PHY-MAP describing the downstream data structure to be transmitted and inserted into the downstream data. Data is extracted from the packet queues in queue blocks as defined by the PHY-MAP.