Patents by Inventor Jack D. Pippin

Jack D. Pippin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9391447
    Abstract: An interposer is described to regulate the current in wafer test tooling. In one example, the interposer includes a first connection pad to couple to automated test equipment and a second connection pad to couple to a device under test. The interposer further includes an overcurrent limit circuit to connect the first and second connection pads and to disconnect the first and second connection pads when the current between the first and second connection pads is over a predetermined amount.
    Type: Grant
    Filed: March 6, 2012
    Date of Patent: July 12, 2016
    Assignee: Intel Corporation
    Inventors: Evan M. Fledell, Paul B. Fischer, Roy E. Swart, Timothy J. Maloney, Jack D. Pippin
  • Publication number: 20140029150
    Abstract: An interposer is described to regulate the current in wafer test tooling. In one example, the interposer includes a first connection pad to couple to automated test equipment and a second connection pad to couple to a device under test. The interposer further includes an overcurrent limit circuit to connect the first and second connection pads and to disconnect the first and second connection pads when the current between the first and second connection pads is over a predetermined amount.
    Type: Application
    Filed: March 6, 2012
    Publication date: January 30, 2014
    Inventors: Evan M. Fledell, Paul B. Fischer, Roy E. Swart, Timothy J. Maloney, Jack D. Pippin
  • Publication number: 20130173082
    Abstract: A programmable thermal sensor is implemented in an integrated circuit such as a microprocessor. The programmable thermal sensor monitors the temperature of the integrated circuit, and generates an output to indicate that the temperature of the integrated circuit has attained a pre-programmed threshold temperature. In a microprocessor implementation, the microprocessor contains a processor unit, an internal register, microprogram and clock circuitry. The microprogram writes programmable input values, corresponding to threshold temperatures, to the internal register. The programmable thermal sensor reads the programmable input values, and generates an interrupt when the temperature of the microprocessor reaches the threshold temperature. In addition to a programmable thermal sensor, the microprocessor contains a fail safe thermal sensor that halts operation of the microprocessor when the temperature attains a critical temperature.
    Type: Application
    Filed: March 5, 2013
    Publication date: July 4, 2013
    Applicant: Intel Corporation
    Inventor: Jack D. Pippin
  • Patent number: 7761274
    Abstract: A temperature-based clock frequency controller is implemented in an integrated circuit such as a microprocessor. The temperature-based clock frequency controller includes a register to store a threshold temperature value, a thermal sensor, and clock adjustment logic to decrease a clock frequency in response to the thermal sensor indicating that the threshold temperature value has been exceeded. In a microprocessor implementation, the microprocessor contains a plurality of thermal sensors each placed in one of a plurality of different locations across the integrated circuit and an averaging mechanism to calculate an average temperature from the plurality of thermal sensors. Threshold adjustment logic increases the threshold temperature value to a new threshold temperature value in response to the thermal sensor indicating that the threshold temperature value has been exceeded. Threshold adjustment logic further lowers the new threshold temperature to detect decreases in temperature.
    Type: Grant
    Filed: November 7, 2000
    Date of Patent: July 20, 2010
    Assignee: Intel Corporation
    Inventor: Jack D. Pippin
  • Patent number: 7587262
    Abstract: A temperature averaging thermal sensor is implemented in an integrated circuit such as a microprocessor. The temperature averaging thermal sensor monitors the temperature of the integrated circuit in a plurality of different locations across the integrated circuit, calculates an average temperature and generates an output to indicate that the average temperature of the integrated circuit has attained a pre-programmed threshold temperature. In a microprocessor implementation, the microprocessor contains a plurality of thermal sensors each placed in one of a plurality of different locations across the integrated circuit and an averaging mechanism to calculate an average temperature from the plurality of thermal sensors. Sense circuitry reads the programmable input values and generates an interrupt when the temperature of the microprocessor reaches a threshold temperature.
    Type: Grant
    Filed: November 7, 2000
    Date of Patent: September 8, 2009
    Assignee: Intel Corporation
    Inventor: Jack D. Pippin
  • Patent number: 7228508
    Abstract: A fail-safe thermal sensor is implemented in an integrated circuit such as a microprocessor. The fail-safe thermal sensor monitors the temperature of the integrated circuit and halt logic halts operation of the integrated circuit in response to the fail-safe thermal sensor indicating that a threshold temperature has been exceeded. The threshold temperature may be a predetermined fixed critical temperature. The halt logic may inhibit operation of the integrated circuit by stopping a clock for the integrated circuit.
    Type: Grant
    Filed: November 7, 2000
    Date of Patent: June 5, 2007
    Assignee: Intel Corporation
    Inventor: Jack D. Pippin
  • Patent number: 7216064
    Abstract: A programmable thermal sensor is implemented in an integrated circuit such as a microprocessor. The programmable thermal sensor monitors the temperature of the integrated circuit, and generates an output to indicate that the temperature of the integrated circuit has attained a preprogrammed threshold temperature. In a microprocessor implementation, the microprocessor contains a processor unit, an internal register, microprogram and clock circuitry. The microprogram writes programmable input values, corresponding to threshold temperatures, to the internal register. The programmable thermal sensor reads the programmable input values, and generates an interrupt when the temperature of the microprocessor reaches the threshold temperature. In addition to a programmable thermal sensor, the microprocessor contains a fail safe thermal sensor that halts operation of the microprocessor when the temperature attains a critical temperature.
    Type: Grant
    Filed: April 19, 1996
    Date of Patent: May 8, 2007
    Assignee: Intel Corporation
    Inventor: Jack D. Pippin
  • Patent number: 7158911
    Abstract: An integrated, on-chip thermal management system providing closed-loop temperature control of an IC device and methods of performing thermal management of an IC device. The thermal management system comprises a temperature detection element, a power modulation element, a control element, and a visibility element. The temperature detection element includes a temperature sensor for detecting die temperature. The power modulation element may reduce the power consumption of an IC device by directly lowering the power consumption of the IC device, by limiting the speed at which the IC device executes instructions, by limiting the number of instructions executed by the IC device, or by a combination of these techniques. The control element allows for control over the behavior of the thermal management system, and the visibility element allows external devices to monitor the status of the thermal management system.
    Type: Grant
    Filed: April 9, 2004
    Date of Patent: January 2, 2007
    Assignee: Intel Corporation
    Inventors: Stephen H. Gunther, Frank Binns, Jack D. Pippin, Linda J. Rankin, Edward A. Burton, Douglas M. Carmean, John M. Bauer
  • Patent number: 6980918
    Abstract: An integrated, on-chip thermal management system providing closed-loop temperature control of an IC device and methods of performing thermal management of an IC device. The thermal management system comprises a temperature detection element, a power modulation element, a control element, and a visibility element. The temperature detection element includes a temperature sensor for detecting die temperature. The power modulation element may reduce the power consumption of an IC device by directly lowering the power consumption of the IC device, by limiting the speed at which the IC device executes instructions, by limiting the number of instructions executed by the IC device, or by a combination of these techniques. The control element allows for control over the behavior of the thermal management system, and the visibility element allows external devices to monitor the status of the thermal management system.
    Type: Grant
    Filed: April 9, 2004
    Date of Patent: December 27, 2005
    Assignee: Intel Corporation
    Inventors: Stephen H. Gunther, Frank Binns, Jack D. Pippin, Linda J. Rankin, Edward A. Burton, Douglas M. Carmean, John M. Bauer
  • Patent number: 6975047
    Abstract: A temperature-based cooling device controller is implemented in an integrated circuit such as a microprocessor. The temperature-based cooling device controller includes a register to store a threshold temperature value, a thermal sensor, and clock adjustment logic to activate a cooling device in response to the thermal sensor indicating that the threshold temperature value has been exceeded. In a microprocessor implementation, the microprocessor contains a plurality of thermal sensors each placed in one of a plurality of different locations across the integrated circuit and an averaging mechanism to calculate an average temperature from the plurality of thermal sensors. Threshold adjustment logic increases the threshold temperature value to a new threshold temperature value in response to the thermal sensor indicating that the threshold temperature value has been exceeded. Threshold adjustment logic further lowers the new threshold temperature to detect decreases in temperature.
    Type: Grant
    Filed: June 18, 2003
    Date of Patent: December 13, 2005
    Assignee: Intel Corporation
    Inventor: Jack D. Pippin
  • Publication number: 20040204899
    Abstract: An integrated, on-chip thermal management system providing closed-loop temperature control of an IC device and methods of performing thermal management of an IC device. The thermal management system comprises a temperature detection element, a power modulation element, a control element, and a visibility element. The temperature detection element includes a temperature sensor for detecting die temperature. The power modulation element may reduce the power consumption of an IC device by directly lowering the power consumption of the IC device, by limiting the speed at which the IC device executes instructions, by limiting the number of instructions executed by the IC device, or by a combination of these techniques. The control element allows for control over the behavior of the thermal management system, and the visibility element allows external devices to monitor the status of the thermal management system.
    Type: Application
    Filed: April 9, 2004
    Publication date: October 14, 2004
    Inventors: Stephen H. Gunther, Frank Binns, Jack D. Pippin, Linda J. Rankin, Edward A. Burton, Douglas M. Carmean, John M. Bauer
  • Publication number: 20040195674
    Abstract: An integrated, on-chip thermal management system providing closed-loop temperature control of an IC device and methods of performing thermal management of an IC device. The thermal management system comprises a temperature detection element, a power modulation element, a control element, and a visibility element. The temperature detection element includes a temperature sensor for detecting die temperature. The power modulation element may reduce the power consumption of an IC device by directly lowering the power consumption of the IC device, by limiting the speed at which the IC device executes instructions, by limiting the number of instructions executed by the IC device, or by a combination of these techniques. The control element allows for control over the behavior of the thermal management system, and the visibility element allows external devices to monitor the status of the thermal management system.
    Type: Application
    Filed: April 9, 2004
    Publication date: October 7, 2004
    Inventors: Stephen H. Gunther, Frank Binns, Jack D. Pippin, Linda J. Rankin, Edward A. Burton, Douglas M. Carmean, John M. Bauer
  • Patent number: 6789037
    Abstract: An integrated, on-chip thermal management system providing closed-loop temperature control of an IC device and methods of performing thermal management of an IC device. The thermal management system comprises a temperature detection element, a power modulation element, a control element, and a visibility element. The temperature detection element includes a temperature sensor for detecting die temperature. The power modulation element may reduce the power consumption of an IC device by directly lowering the power consumption of the IC device, by limiting the speed at which the IC device executes instructions, by limiting the number of instructions executed by the IC device, or by a combination of these techniques. The control element allows for control over the behavior of the thermal management system, and the visibility element allows external devices to monitor the status of the thermal management system.
    Type: Grant
    Filed: February 14, 2001
    Date of Patent: September 7, 2004
    Assignee: Intel Corporation
    Inventors: Stephen H. Gunther, Frank Binns, Jack D. Pippin, Linda J. Rankin, Edward A. Burton, Douglas M. Carmean, John M. Bauer
  • Publication number: 20040047099
    Abstract: A temperature-based cooling device controller is implemented in an integrated circuit such as a microprocessor. The temperature-based cooling device controller includes a register to store a threshold temperature value, a thermal sensor, and clock adjustment logic to activate a cooling device in response to the thermal sensor indicating that the threshold temperature value has been exceeded. In a microprocessor implementation, the microprocessor contains a plurality of thermal sensors each placed in one of a plurality of different locations across the integrated circuit and an averaging mechanism to calculate an average temperature from the plurality of thermal sensors. Threshold adjustment logic increases the threshold temperature value to a new threshold temperature value in response to the thermal sensor indicating that the threshold temperature value has been exceeded. Threshold adjustment logic further lowers the new threshold temperature to detect decreases in temperature.
    Type: Application
    Filed: June 18, 2003
    Publication date: March 11, 2004
    Inventor: Jack D. Pippin
  • Publication number: 20030212474
    Abstract: A programmable thermal sensor is implemented in an integrated circuit such as a microprocessor. The programmable thermal sensor monitors the temperature of the integrated circuit, and generates an output to indicate that the temperature of the integrated circuit has attained a pre-programmed threshold temperature. In a microprocessor implementation, the microprocessor contains a processor unit, an internal register, microprogram and clock circuitry. The microprogram writes programmable input values, corresponding to threshold temperatures, to the internal register. The programmable thermal sensor reads the programmable input values, and generates an interrupt when the temperature of the microprocessor reaches the threshold temperature. In addition to a programmable thermal sensor, the microprocessor contains a fail safe thermal sensor that halts operation of the microprocessor when the temperature attains a critical temperature.
    Type: Application
    Filed: June 19, 2003
    Publication date: November 13, 2003
    Applicant: Intel Corporation
    Inventor: Jack D. Pippin
  • Patent number: 6630754
    Abstract: A temperature-based cooling device controller includes a register to store a threshold temperature value, a thermal sensor, and cooling activation logic to activate an active cooling device in response to an interrupt signal. The thermal sensor includes a current source, a voltage reference coupled to the current source to provide a bandgap reference voltage, wherein the bandgap reference voltage is substantially constant over a range of temperatures, programmable circuitry providing an output voltage that varies with the integrated circuit temperature and in accordance with the register value, and a comparator, wherein the comparator generates an interrupt signal if a difference between the output voltage and the bandgap reference voltage indicates that the threshold temperature has been exceeded.
    Type: Grant
    Filed: November 7, 2000
    Date of Patent: October 7, 2003
    Assignee: Intel Corporation
    Inventor: Jack D. Pippin
  • Patent number: 6393374
    Abstract: A method and apparatus for power throttling to manage the temperature of an IC. A temperature sensor is manufactured on the same die as the IC components. The temperature sensor generates an output in response to junction temperature of the IC components. A state machine is coupled to receive the output of the temperature sensor and to provide power reduction functions in response to the temperature sensor output exceeding a maximum thermal value. The maximum thermal value is less than the maximum allowable temperature of the IC corresponding to maximum power consumption. Thus, the invention reduces power consumption at a thermal value lower that a potentially catastrophic value rather than shutting down the IC when catastrophic failure is imminent.
    Type: Grant
    Filed: March 30, 1999
    Date of Patent: May 21, 2002
    Assignee: Intel Corporation
    Inventors: Linda J. Rankin, Edward A. Burton, Stephen H. Gunther, Jack D. Pippin
  • Publication number: 20010021217
    Abstract: An integrated, on-chip thermal management system providing closed-loop temperature control of an IC device and methods of performing thermal management of an IC device. The thermal management system comprises a temperature detection element, a power modulation element, a control element, and a visibility element. The temperature detection element includes a temperature sensor for detecting die temperature. The power modulation element may reduce the power consumption of an IC device by directly lowering the power consumption of the IC device, by limiting the speed at which the IC device executes instructions, by limiting the number of instructions executed by the IC device, or by a combination of these techniques. The control element allows for control over the behavior of the thermal management system, and the visibility element allows external devices to monitor the status of the thermal management system.
    Type: Application
    Filed: February 14, 2001
    Publication date: September 13, 2001
    Inventors: Stephen H. Gunther, Frank Binns, Jack D. Pippin, Linda J. Rankin, Edward A. Burton, Douglas M. Carmean, John M. Bauer
  • Patent number: 6072349
    Abstract: A comparator includes an amplifier that has an offset voltage that is responsive to a level of current. A current source of the comparator is configured to be selectably enabled to adjust the level of the current to change the offset voltage.
    Type: Grant
    Filed: December 31, 1997
    Date of Patent: June 6, 2000
    Assignee: Intel Corporation
    Inventors: Jack D. Pippin, Bal S. Sandhu
  • Patent number: H2294
    Abstract: A programmable thermal sensor is implemented in an integrated circuit such as a microprocessor. The programmable thermal sensor monitors the temperature of the integrated circuit, and generates an output to indicate that the temperature of the integrated circuit has attained a pre-programmed threshold temperature. In a microprocessor implementation, the microprocessor contains a processor unit, an internal register, microprogram and clock circuitry. The microprogram writes programmable input values, corresponding to threshold temperatures, to the internal register. The programmable thermal sensor reads the programmable input values, and generates an interrupt when the temperature of the microprocessor reaches the threshold temperature. In addition to a programmable thermal sensor, the microprocessor contains a fail safe thermal sensor that halts operation of the microprocessor when the temperature attains a critical temperature.
    Type: Grant
    Filed: March 5, 2013
    Date of Patent: August 7, 2018
    Assignee: Intel Corporation
    Inventor: Jack D. Pippin