Patents by Inventor Jack D. Pippin
Jack D. Pippin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9391447Abstract: An interposer is described to regulate the current in wafer test tooling. In one example, the interposer includes a first connection pad to couple to automated test equipment and a second connection pad to couple to a device under test. The interposer further includes an overcurrent limit circuit to connect the first and second connection pads and to disconnect the first and second connection pads when the current between the first and second connection pads is over a predetermined amount.Type: GrantFiled: March 6, 2012Date of Patent: July 12, 2016Assignee: Intel CorporationInventors: Evan M. Fledell, Paul B. Fischer, Roy E. Swart, Timothy J. Maloney, Jack D. Pippin
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Publication number: 20140029150Abstract: An interposer is described to regulate the current in wafer test tooling. In one example, the interposer includes a first connection pad to couple to automated test equipment and a second connection pad to couple to a device under test. The interposer further includes an overcurrent limit circuit to connect the first and second connection pads and to disconnect the first and second connection pads when the current between the first and second connection pads is over a predetermined amount.Type: ApplicationFiled: March 6, 2012Publication date: January 30, 2014Inventors: Evan M. Fledell, Paul B. Fischer, Roy E. Swart, Timothy J. Maloney, Jack D. Pippin
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Publication number: 20130173082Abstract: A programmable thermal sensor is implemented in an integrated circuit such as a microprocessor. The programmable thermal sensor monitors the temperature of the integrated circuit, and generates an output to indicate that the temperature of the integrated circuit has attained a pre-programmed threshold temperature. In a microprocessor implementation, the microprocessor contains a processor unit, an internal register, microprogram and clock circuitry. The microprogram writes programmable input values, corresponding to threshold temperatures, to the internal register. The programmable thermal sensor reads the programmable input values, and generates an interrupt when the temperature of the microprocessor reaches the threshold temperature. In addition to a programmable thermal sensor, the microprocessor contains a fail safe thermal sensor that halts operation of the microprocessor when the temperature attains a critical temperature.Type: ApplicationFiled: March 5, 2013Publication date: July 4, 2013Applicant: Intel CorporationInventor: Jack D. Pippin
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Patent number: 7761274Abstract: A temperature-based clock frequency controller is implemented in an integrated circuit such as a microprocessor. The temperature-based clock frequency controller includes a register to store a threshold temperature value, a thermal sensor, and clock adjustment logic to decrease a clock frequency in response to the thermal sensor indicating that the threshold temperature value has been exceeded. In a microprocessor implementation, the microprocessor contains a plurality of thermal sensors each placed in one of a plurality of different locations across the integrated circuit and an averaging mechanism to calculate an average temperature from the plurality of thermal sensors. Threshold adjustment logic increases the threshold temperature value to a new threshold temperature value in response to the thermal sensor indicating that the threshold temperature value has been exceeded. Threshold adjustment logic further lowers the new threshold temperature to detect decreases in temperature.Type: GrantFiled: November 7, 2000Date of Patent: July 20, 2010Assignee: Intel CorporationInventor: Jack D. Pippin
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Patent number: 7587262Abstract: A temperature averaging thermal sensor is implemented in an integrated circuit such as a microprocessor. The temperature averaging thermal sensor monitors the temperature of the integrated circuit in a plurality of different locations across the integrated circuit, calculates an average temperature and generates an output to indicate that the average temperature of the integrated circuit has attained a pre-programmed threshold temperature. In a microprocessor implementation, the microprocessor contains a plurality of thermal sensors each placed in one of a plurality of different locations across the integrated circuit and an averaging mechanism to calculate an average temperature from the plurality of thermal sensors. Sense circuitry reads the programmable input values and generates an interrupt when the temperature of the microprocessor reaches a threshold temperature.Type: GrantFiled: November 7, 2000Date of Patent: September 8, 2009Assignee: Intel CorporationInventor: Jack D. Pippin
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Patent number: 7228508Abstract: A fail-safe thermal sensor is implemented in an integrated circuit such as a microprocessor. The fail-safe thermal sensor monitors the temperature of the integrated circuit and halt logic halts operation of the integrated circuit in response to the fail-safe thermal sensor indicating that a threshold temperature has been exceeded. The threshold temperature may be a predetermined fixed critical temperature. The halt logic may inhibit operation of the integrated circuit by stopping a clock for the integrated circuit.Type: GrantFiled: November 7, 2000Date of Patent: June 5, 2007Assignee: Intel CorporationInventor: Jack D. Pippin
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Patent number: 7216064Abstract: A programmable thermal sensor is implemented in an integrated circuit such as a microprocessor. The programmable thermal sensor monitors the temperature of the integrated circuit, and generates an output to indicate that the temperature of the integrated circuit has attained a preprogrammed threshold temperature. In a microprocessor implementation, the microprocessor contains a processor unit, an internal register, microprogram and clock circuitry. The microprogram writes programmable input values, corresponding to threshold temperatures, to the internal register. The programmable thermal sensor reads the programmable input values, and generates an interrupt when the temperature of the microprocessor reaches the threshold temperature. In addition to a programmable thermal sensor, the microprocessor contains a fail safe thermal sensor that halts operation of the microprocessor when the temperature attains a critical temperature.Type: GrantFiled: April 19, 1996Date of Patent: May 8, 2007Assignee: Intel CorporationInventor: Jack D. Pippin
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Patent number: 7158911Abstract: An integrated, on-chip thermal management system providing closed-loop temperature control of an IC device and methods of performing thermal management of an IC device. The thermal management system comprises a temperature detection element, a power modulation element, a control element, and a visibility element. The temperature detection element includes a temperature sensor for detecting die temperature. The power modulation element may reduce the power consumption of an IC device by directly lowering the power consumption of the IC device, by limiting the speed at which the IC device executes instructions, by limiting the number of instructions executed by the IC device, or by a combination of these techniques. The control element allows for control over the behavior of the thermal management system, and the visibility element allows external devices to monitor the status of the thermal management system.Type: GrantFiled: April 9, 2004Date of Patent: January 2, 2007Assignee: Intel CorporationInventors: Stephen H. Gunther, Frank Binns, Jack D. Pippin, Linda J. Rankin, Edward A. Burton, Douglas M. Carmean, John M. Bauer
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Patent number: 6980918Abstract: An integrated, on-chip thermal management system providing closed-loop temperature control of an IC device and methods of performing thermal management of an IC device. The thermal management system comprises a temperature detection element, a power modulation element, a control element, and a visibility element. The temperature detection element includes a temperature sensor for detecting die temperature. The power modulation element may reduce the power consumption of an IC device by directly lowering the power consumption of the IC device, by limiting the speed at which the IC device executes instructions, by limiting the number of instructions executed by the IC device, or by a combination of these techniques. The control element allows for control over the behavior of the thermal management system, and the visibility element allows external devices to monitor the status of the thermal management system.Type: GrantFiled: April 9, 2004Date of Patent: December 27, 2005Assignee: Intel CorporationInventors: Stephen H. Gunther, Frank Binns, Jack D. Pippin, Linda J. Rankin, Edward A. Burton, Douglas M. Carmean, John M. Bauer
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Patent number: 6975047Abstract: A temperature-based cooling device controller is implemented in an integrated circuit such as a microprocessor. The temperature-based cooling device controller includes a register to store a threshold temperature value, a thermal sensor, and clock adjustment logic to activate a cooling device in response to the thermal sensor indicating that the threshold temperature value has been exceeded. In a microprocessor implementation, the microprocessor contains a plurality of thermal sensors each placed in one of a plurality of different locations across the integrated circuit and an averaging mechanism to calculate an average temperature from the plurality of thermal sensors. Threshold adjustment logic increases the threshold temperature value to a new threshold temperature value in response to the thermal sensor indicating that the threshold temperature value has been exceeded. Threshold adjustment logic further lowers the new threshold temperature to detect decreases in temperature.Type: GrantFiled: June 18, 2003Date of Patent: December 13, 2005Assignee: Intel CorporationInventor: Jack D. Pippin
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Publication number: 20040204899Abstract: An integrated, on-chip thermal management system providing closed-loop temperature control of an IC device and methods of performing thermal management of an IC device. The thermal management system comprises a temperature detection element, a power modulation element, a control element, and a visibility element. The temperature detection element includes a temperature sensor for detecting die temperature. The power modulation element may reduce the power consumption of an IC device by directly lowering the power consumption of the IC device, by limiting the speed at which the IC device executes instructions, by limiting the number of instructions executed by the IC device, or by a combination of these techniques. The control element allows for control over the behavior of the thermal management system, and the visibility element allows external devices to monitor the status of the thermal management system.Type: ApplicationFiled: April 9, 2004Publication date: October 14, 2004Inventors: Stephen H. Gunther, Frank Binns, Jack D. Pippin, Linda J. Rankin, Edward A. Burton, Douglas M. Carmean, John M. Bauer
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Publication number: 20040195674Abstract: An integrated, on-chip thermal management system providing closed-loop temperature control of an IC device and methods of performing thermal management of an IC device. The thermal management system comprises a temperature detection element, a power modulation element, a control element, and a visibility element. The temperature detection element includes a temperature sensor for detecting die temperature. The power modulation element may reduce the power consumption of an IC device by directly lowering the power consumption of the IC device, by limiting the speed at which the IC device executes instructions, by limiting the number of instructions executed by the IC device, or by a combination of these techniques. The control element allows for control over the behavior of the thermal management system, and the visibility element allows external devices to monitor the status of the thermal management system.Type: ApplicationFiled: April 9, 2004Publication date: October 7, 2004Inventors: Stephen H. Gunther, Frank Binns, Jack D. Pippin, Linda J. Rankin, Edward A. Burton, Douglas M. Carmean, John M. Bauer
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Patent number: 6789037Abstract: An integrated, on-chip thermal management system providing closed-loop temperature control of an IC device and methods of performing thermal management of an IC device. The thermal management system comprises a temperature detection element, a power modulation element, a control element, and a visibility element. The temperature detection element includes a temperature sensor for detecting die temperature. The power modulation element may reduce the power consumption of an IC device by directly lowering the power consumption of the IC device, by limiting the speed at which the IC device executes instructions, by limiting the number of instructions executed by the IC device, or by a combination of these techniques. The control element allows for control over the behavior of the thermal management system, and the visibility element allows external devices to monitor the status of the thermal management system.Type: GrantFiled: February 14, 2001Date of Patent: September 7, 2004Assignee: Intel CorporationInventors: Stephen H. Gunther, Frank Binns, Jack D. Pippin, Linda J. Rankin, Edward A. Burton, Douglas M. Carmean, John M. Bauer
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Publication number: 20040047099Abstract: A temperature-based cooling device controller is implemented in an integrated circuit such as a microprocessor. The temperature-based cooling device controller includes a register to store a threshold temperature value, a thermal sensor, and clock adjustment logic to activate a cooling device in response to the thermal sensor indicating that the threshold temperature value has been exceeded. In a microprocessor implementation, the microprocessor contains a plurality of thermal sensors each placed in one of a plurality of different locations across the integrated circuit and an averaging mechanism to calculate an average temperature from the plurality of thermal sensors. Threshold adjustment logic increases the threshold temperature value to a new threshold temperature value in response to the thermal sensor indicating that the threshold temperature value has been exceeded. Threshold adjustment logic further lowers the new threshold temperature to detect decreases in temperature.Type: ApplicationFiled: June 18, 2003Publication date: March 11, 2004Inventor: Jack D. Pippin
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Publication number: 20030212474Abstract: A programmable thermal sensor is implemented in an integrated circuit such as a microprocessor. The programmable thermal sensor monitors the temperature of the integrated circuit, and generates an output to indicate that the temperature of the integrated circuit has attained a pre-programmed threshold temperature. In a microprocessor implementation, the microprocessor contains a processor unit, an internal register, microprogram and clock circuitry. The microprogram writes programmable input values, corresponding to threshold temperatures, to the internal register. The programmable thermal sensor reads the programmable input values, and generates an interrupt when the temperature of the microprocessor reaches the threshold temperature. In addition to a programmable thermal sensor, the microprocessor contains a fail safe thermal sensor that halts operation of the microprocessor when the temperature attains a critical temperature.Type: ApplicationFiled: June 19, 2003Publication date: November 13, 2003Applicant: Intel CorporationInventor: Jack D. Pippin
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Patent number: 6630754Abstract: A temperature-based cooling device controller includes a register to store a threshold temperature value, a thermal sensor, and cooling activation logic to activate an active cooling device in response to an interrupt signal. The thermal sensor includes a current source, a voltage reference coupled to the current source to provide a bandgap reference voltage, wherein the bandgap reference voltage is substantially constant over a range of temperatures, programmable circuitry providing an output voltage that varies with the integrated circuit temperature and in accordance with the register value, and a comparator, wherein the comparator generates an interrupt signal if a difference between the output voltage and the bandgap reference voltage indicates that the threshold temperature has been exceeded.Type: GrantFiled: November 7, 2000Date of Patent: October 7, 2003Assignee: Intel CorporationInventor: Jack D. Pippin
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Patent number: 6393374Abstract: A method and apparatus for power throttling to manage the temperature of an IC. A temperature sensor is manufactured on the same die as the IC components. The temperature sensor generates an output in response to junction temperature of the IC components. A state machine is coupled to receive the output of the temperature sensor and to provide power reduction functions in response to the temperature sensor output exceeding a maximum thermal value. The maximum thermal value is less than the maximum allowable temperature of the IC corresponding to maximum power consumption. Thus, the invention reduces power consumption at a thermal value lower that a potentially catastrophic value rather than shutting down the IC when catastrophic failure is imminent.Type: GrantFiled: March 30, 1999Date of Patent: May 21, 2002Assignee: Intel CorporationInventors: Linda J. Rankin, Edward A. Burton, Stephen H. Gunther, Jack D. Pippin
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Publication number: 20010021217Abstract: An integrated, on-chip thermal management system providing closed-loop temperature control of an IC device and methods of performing thermal management of an IC device. The thermal management system comprises a temperature detection element, a power modulation element, a control element, and a visibility element. The temperature detection element includes a temperature sensor for detecting die temperature. The power modulation element may reduce the power consumption of an IC device by directly lowering the power consumption of the IC device, by limiting the speed at which the IC device executes instructions, by limiting the number of instructions executed by the IC device, or by a combination of these techniques. The control element allows for control over the behavior of the thermal management system, and the visibility element allows external devices to monitor the status of the thermal management system.Type: ApplicationFiled: February 14, 2001Publication date: September 13, 2001Inventors: Stephen H. Gunther, Frank Binns, Jack D. Pippin, Linda J. Rankin, Edward A. Burton, Douglas M. Carmean, John M. Bauer
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Patent number: 6072349Abstract: A comparator includes an amplifier that has an offset voltage that is responsive to a level of current. A current source of the comparator is configured to be selectably enabled to adjust the level of the current to change the offset voltage.Type: GrantFiled: December 31, 1997Date of Patent: June 6, 2000Assignee: Intel CorporationInventors: Jack D. Pippin, Bal S. Sandhu
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Patent number: H2294Abstract: A programmable thermal sensor is implemented in an integrated circuit such as a microprocessor. The programmable thermal sensor monitors the temperature of the integrated circuit, and generates an output to indicate that the temperature of the integrated circuit has attained a pre-programmed threshold temperature. In a microprocessor implementation, the microprocessor contains a processor unit, an internal register, microprogram and clock circuitry. The microprogram writes programmable input values, corresponding to threshold temperatures, to the internal register. The programmable thermal sensor reads the programmable input values, and generates an interrupt when the temperature of the microprocessor reaches the threshold temperature. In addition to a programmable thermal sensor, the microprocessor contains a fail safe thermal sensor that halts operation of the microprocessor when the temperature attains a critical temperature.Type: GrantFiled: March 5, 2013Date of Patent: August 7, 2018Assignee: Intel CorporationInventor: Jack D. Pippin