Patents by Inventor Jack E. Caveney
Jack E. Caveney has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9011181Abstract: A network cable jack includes a printed circuit board (PCB) for balancing both inductive and capacitive coupling. Using a PCB allows compact trace paths to be formed without significantly increasing manufacturing costs. By including on each trace path two distinct inductance zones separated by a neutral zone, significant gains in degrees of freedom are achieved for designing PCB trace patterns in which a pair of inductive coupling zones jointly offset the inductive coupling caused by a specification plug and the jack contacts, both in magnitude and phase angle. Further, using distinct inductance zones offers more freedom regarding the placement of capacitive plates for use in capacitance balancing as well as the placement of terminals and insulation displacement contacts. Although the magnitude of a capacitive coupling is determined by the length of the capacitor plates parallel to current carrying traces, the approach allows capacitive and inductive coupling to be balanced independently.Type: GrantFiled: May 5, 2014Date of Patent: April 21, 2015Assignee: Panduit Corp.Inventors: Jack E. Caveney, Scott M. Lesniak
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Patent number: 8992264Abstract: A communication jack, system using the jack, and method of fabricating the jack are disclosed. The jack includes a cavity configured to accept a communication plug to form a communication connector. The jack includes a plurality of plug interface contacts that extend into the cavity such that a plug inserted into the cavity makes electrical contact with the plug interface contacts at plug/jack interfaces of the plug interface contacts. One or more of the plug interface contacts is formed from multiple conductive layers. The conductive layers are movable relative to each other at at least one end. A dielectric layer or flexible printed circuit board may be disposed between the conductive layers.Type: GrantFiled: May 5, 2014Date of Patent: March 31, 2015Assignee: Panduit Corp.Inventors: Jack E. Caveney, Satish I. Patel
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Publication number: 20150024613Abstract: An apparatus and method for crosstalk compensation in a jack of a modular communications connector includes a flexible printed circuit board connected to jack contacts and to connections to a network cable. The flexible printed circuit board includes conductive traces arranged as one or more couplings to provide crosstalk compensation.Type: ApplicationFiled: September 2, 2014Publication date: January 22, 2015Applicant: Panduit Corp.Inventors: Jack E. Caveney, Masud Bolouri-Saransar, Scott M. Lesniak
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Publication number: 20150007929Abstract: A self-laminating rotating cable marker label is constructed of a transparent film having a first adhesive area, an adhesive-free smooth area, and a second adhesive area. A print-on area forms one side of the transparent film, the print-on area adapted to receive indicia identifying the cable about which the marker label is applied. A perforation extends across the transparent film providing a line of separation of the transparent film. When wrapped around a cable, the second adhesive area overlies the print-on area such that the cable identifying indicia is visible through the transparent second adhesive area. As the transparent film is wrapped around the cable, the first adhesive area adheres to the cable. The remainder of the transparent film is rotated, breaking the perforation, whereby the smooth area of the film in contact with the cable provides smooth rotation of the label around the cable.Type: ApplicationFiled: September 15, 2014Publication date: January 8, 2015Applicant: PANDUIT CORP.Inventors: Jack E. Caveney, David Scott Morrison, Michael Scott Adams
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Publication number: 20150004849Abstract: A communication jack having crosstalk compensation features for overall crosstalk interference reduction is disclosed. In one embodiment, the jack is configured to receive a plug to form a communication connection, and comprises jack contacts disposed in the jack, with each contact having at least a first surface and a second surface. Upon the plug being received by the jack, the plug contacts interface with the first surface of the jack contacts. The jack further includes a first capacitive coupling connected between two pairs of jack contacts to compensate for near end crosstalk, with the first capacitive coupling being connected to the pairs of jack contacts along the second surface adjacent to where the plug contacts interface with the jack contacts. A far end crosstalk compensation scheme is also set forth.Type: ApplicationFiled: September 15, 2014Publication date: January 1, 2015Applicant: PANDUIT CORP.Inventors: Jack E. Caveney, Masud Bolouri-Saransar
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Patent number: 8834207Abstract: A communication jack having crosstalk compensation features for overall crosstalk interference reduction is disclosed. In one embodiment, the jack is configured to receive a plug to form a communication connection, and comprises jack contacts disposed in the jack, with each contact having at least a first surface and a second surface. Upon the plug being received by the jack, the plug contacts interface with the first surface of the jack contacts. The jack further includes a first capacitive coupling connected between two pairs of jack contacts to compensate for near end crosstalk, with the first capacitive coupling being connected to the pairs of jack contacts along the second surface adjacent to where the plug contacts interface with the jack contacts. A far end crosstalk compensation scheme is also set forth.Type: GrantFiled: October 7, 2013Date of Patent: September 16, 2014Assignee: Panduit Corp.Inventors: Jack E. Caveney, Masud Bolouri-Saransar
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Publication number: 20140256190Abstract: A network cable jack includes a printed circuit board (PCB) for balancing both inductive and capacitive coupling. Using a PCB allows compact trace paths to be formed without significantly increasing manufacturing costs. By including on each trace path two distinct inductance zones separated by a neutral zone, significant gains in degrees of freedom are achieved for designing PCB trace patterns in which a pair of inductive coupling zones jointly offset the inductive coupling caused by a specification plug and the jack contacts, both in magnitude and phase angle. Further, using distinct inductance zones offers more freedom regarding the placement of capacitive plates for use in capacitance balancing as well as the placement of terminals and insulation displacement contacts. Although the magnitude of a capacitive coupling is determined by the length of the capacitor plates parallel to current carrying traces, the approach allows capacitive and inductive coupling to be balanced independently.Type: ApplicationFiled: May 5, 2014Publication date: September 11, 2014Applicant: PANDUIT CORP.Inventors: Jack E. Caveney, Scott M. Lesniak
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Publication number: 20140254987Abstract: A fiber optic stub fiber connector for reversibly and nondestructively terminating an inserted field fiber having a buffer over at least a portion thereof. The connector includes a housing and a ferrule including a stub fiber disposed within and extending from a bore through the ferrule. The ferrule is generally at least partially disposed within and supported by the housing. The connector further includes a reversible actuator for reversibly and nondestructively terminating the inserted field fiber to the stub fiber. The reversible actuator includes a buffer clamp for engaging with the buffer to simultaneously provide reversible and nondestructive strain relief to the terminated field fiber.Type: ApplicationFiled: April 21, 2014Publication date: September 11, 2014Applicant: Panduit Corp.Inventors: Jack E. Caveney, Shaun P. Brouwer, Vincent M. Barone, Scott R. Hartman, Andrew J. Stroede
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Publication number: 20140256191Abstract: A communication jack, system using the jack, and method of fabricating the jack are disclosed. The jack includes a cavity configured to accept a communication plug to form a communication connector. The jack includes a plurality of plug interface contacts that extend into the cavity such that a plug inserted into the cavity makes electrical contact with the plug interface contacts at plug/jack interfaces of the plug interface contacts. One or more of the plug interface contacts is formed from multiple conductive layers. The conductive layers are movable relative to each other at at least one end. A dielectric layer or flexible printed circuit board may be disposed between the conductive layers.Type: ApplicationFiled: May 5, 2014Publication date: September 11, 2014Applicant: Panduit Corp.Inventors: Jack E. Caveney, Satish I. Patel
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Patent number: 8826532Abstract: An apparatus and method for crosstalk compensation in a jack of a modular communications connector includes a flexible printed circuit board connected to jack contacts and to connections to a network cable. The flexible printed circuit board includes conductive traces arranged as one or more couplings to provide crosstalk compensation.Type: GrantFiled: November 1, 2010Date of Patent: September 9, 2014Assignee: Panduit Corp.Inventors: Jack E. Caveney, Masud Bolouri-Saransar, Scott M. Lesniak
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Patent number: 8758060Abstract: A communication jack, system using the jack, and method of fabricating the jack are disclosed. The jack includes a cavity configured to accept a communication plug to faun a communication connector. The jack includes a plurality of plug interface contacts that extend into the cavity such that a plug inserted into the cavity makes electrical contact with the plug interface contacts at plug/jack interfaces of the plug interface contacts. One or more of the plug interface contacts is formed from multiple conductive layers. The conductive layers are movable relative to each other at at least one end. A dielectric layer or flexible printed circuit board may be disposed between the conductive layers.Type: GrantFiled: May 3, 2013Date of Patent: June 24, 2014Assignee: Panduit Corp.Inventors: Jack E. Caveney, Satish I. Patel
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Patent number: 8721360Abstract: An intelligent network patch field management system and specialized cross-connect cable are provided to help guide, monitor, and report on the process of connecting and disconnecting patch cords plugs in a cross-connect patching environment. The system is also capable of monitoring patch cord connections to detect insertions or removals of patch cords or plugs. The cross-connect cable is provided with LED's in both of the cable plugs. When only one plug of the cross-connect cable is plugged into a port, the LED associated with that plug is switched out of the circuit, while the LED in the unplugged plug remains in the circuit and can still be illuminated by the system.Type: GrantFiled: February 25, 2013Date of Patent: May 13, 2014Assignee: Panduit Corp.Inventors: Jack E. Caveney, Ronald A. Nordin
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Patent number: 8715013Abstract: A network cable jack includes a printed circuit board (PCB) for balancing both inductive and capacitive coupling. Using a PCB allows compact trace paths to be formed without significantly increasing manufacturing costs. By including on each trace path two distinct inductance zones separated by a neutral zone, significant gains in degrees of freedom are achieved for designing PCB trace patterns in which a pair of inductive coupling zones jointly offset the inductive coupling caused by a specification plug and the jack contacts, both in magnitude and phase angle. Further, using distinct inductance zones offers more freedom regarding the placement of capacitive plates for use in capacitance balancing as well as the placement of terminals and insulation displacement contacts. Although the magnitude of a capacitive coupling is determined by the length of the capacitor plates parallel to current carrying traces, the approach allows capacitive and inductive coupling to be balanced independently.Type: GrantFiled: July 13, 2012Date of Patent: May 6, 2014Assignee: Panduit Corp.Inventors: Jack E. Caveney, Scott M. Lesniak
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Patent number: 8702453Abstract: The invention is a modular cable termination plug having a conductor divider having an entrant barb and a plurality of divider channels, a load bar having a plurality of through holes and a plurality of slots, and a plurality of contact terminals. Additionally, the invention may include a housing, a strain relief collar and a strain relief boot.Type: GrantFiled: September 28, 2012Date of Patent: April 22, 2014Assignee: Panduit Corp.Inventors: Jack E. Caveney, Michael V. Doorhy, David A. Dylkiewicz, Jason J. German, Nicholas G. Martino
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Patent number: 8701252Abstract: Certain embodiments of the present invention provide a hook and loop tie for securing a bundle of cables. The hook and loop tie comprises a loop component, a non-slip component, and a hook component. The loop component has a first end and a second end opposite the first end. The non-slip component is affixed to the loop component and extends from the first end of the loop component toward the second end of the loop component. The hook component is affixed to the loop component, extends from the second end of the loop component toward the first end of the loop component, and overlaps at least a portion of the non-slip component.Type: GrantFiled: December 1, 2010Date of Patent: April 22, 2014Assignee: Panduit Corp.Inventors: Jack E. Caveney, David W. West, Gary L. Zernach
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Patent number: 8702324Abstract: A fiber optic stub fiber connector for reversibly and nondestructively terminating an inserted field fiber having a buffer over at least a portion thereof. The connector includes a housing and a ferrule including a stub fiber disposed within and extending from a bore through the ferrule. The ferrule is generally at least partially disposed within and supported by the housing. The connector further includes a reversible actuator for reversibly and nondestructively terminating the inserted field fiber to the stub fiber. The reversible actuator includes a buffer clamp for engaging with the buffer to simultaneously provide reversible and nondestructive strain relief to the terminated field fiber.Type: GrantFiled: August 28, 2012Date of Patent: April 22, 2014Assignee: Panduit Corp.Inventors: Jack E. Caveney, Shaun P. Brouwer, Vincent M. Barone, Scott R. Hartman, Andrew J. Stroede
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Patent number: 8686870Abstract: An intelligent physical layer management system is provided that includes active electronic hardware, firmware, mechanical assemblies, cables, and software that guide, monitor, and report on the process of connecting and disconnecting patch cords plugs in an interconnect patching environment. RFID tag integrated chips are used to identify which switch port a patch cord is plugged into. The system is capable of monitoring patch cord connections to detect insertions or removals of patch cords or plugs. In addition, the system can map the patch field in interconnect configurations.Type: GrantFiled: March 26, 2010Date of Patent: April 1, 2014Assignee: Panduit Corp.Inventors: Jack E. Caveney, Ronald A. Nordin
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Publication number: 20140080354Abstract: An intelligent network patch field management system is provided that includes active electronic hardware, firmware, mechanical assemblies, cables, and software that guide, monitor, and report on the process of connecting and disconnecting patch cords plugs in an interconnect or cross-connect patching environment. The system is also capable of monitoring patch cord connections to detect insertions or removals of patch cords or plugs. In addition, the system can map embodiments of patch fields.Type: ApplicationFiled: November 15, 2013Publication date: March 20, 2014Applicant: Panduit Corp.Inventors: Jack E. Caveney, Ronald A. Nordin, Shahriar B. Allen
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Patent number: 8665107Abstract: An intelligent network physical layer management system is provided that includes hardware that tracks the connection of plugs of patch cords in interconnect or cross-connect patching environments. RFID signaling is combined with near-field communication techniques to provide a reliable physical layer management system. In interconnect configurations, RFID tags are associated with switch ports of an Ethernet switch, enabling the system of the present invention to detect patch cord insertion and removal at switch ports and to receive information about the switch ports. In cross-connect configurations, RFID signaling is used to track the connections of patch cords between two patch panels. Systems according to the present invention avoid the problems associated with traditional galvanic connections previously used for tracking patch cord connections. An alternative common-mode system is also described.Type: GrantFiled: April 16, 2013Date of Patent: March 4, 2014Assignee: Panduit Corp.Inventors: Jack E. Caveney, Ronald A. Nordin
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Publication number: 20140038461Abstract: A communication jack having crosstalk compensation features for overall crosstalk interference reduction is disclosed. In one embodiment, the jack is configured to receive a plug to form a communication connection, and comprises jack contacts disposed in the jack, with each contact having at least a first surface and a second surface. Upon the plug being received by the jack, the plug contacts interface with the first surface of the jack contacts. The jack further includes a first capacitive coupling connected between two pairs of jack contacts to compensate for near end crosstalk, with the first capacitive coupling being connected to the pairs of jack contacts along the second surface adjacent to where the plug contacts interface with the jack contacts. A far end crosstalk compensation scheme is also set forth.Type: ApplicationFiled: October 7, 2013Publication date: February 6, 2014Applicant: PANDUIT CORP.Inventors: Jack E. Caveney, Masud Bolouri-Saransar