Patents by Inventor Jack E. Hetzner

Jack E. Hetzner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210347997
    Abstract: A process for producing a sealed stitched skin structure including the steps of: (a) providing a stitched skin member; (b) providing an aqueous thermoplastic polyolefin dispersion sealant coating composition; (c) applying the aqueous thermoplastic polyolefin dispersion sealant coating composition from step (a) to at least a portion of the surface of at least one side of the skin member to form a wet film or coating of the thermoplastic polyolefin dispersion sealant coating composition on the surface of the skin member; (d) drying the wet coating from step (c) on the skin member surface; and (e) heating the dried skin member from step (d) at a temperature sufficient to form a film or coating of the aqueous thermoplastic polyolefin dispersion sealant coating composition on the stitches of the seam in the skin member; wherein the film or coating seals the stitches in the skin member; a sealed stitched skin structure made by the process above; and a polyurethane foamed article.
    Type: Application
    Filed: October 15, 2019
    Publication date: November 11, 2021
    Inventors: Parvinder S. Walia, George A. Klumb, Jack E. Hetzner
  • Publication number: 20210347998
    Abstract: An aqueous acrylic emulsion sealant coating composition used for sealing stitched skins against leakage from polyurethane foam which has been applied to stitched skins, the composition including: (a) a first soft acrylic polymer phase component; and (b) a second aqueous phase component; a process for producing the sealant coating composition; a sealed stitched skin structure; a process for producing the sealed stitched skin structure; a polyurethane foamed article; and a process for producing the polyurethane foamed article.
    Type: Application
    Filed: October 15, 2019
    Publication date: November 11, 2021
    Inventors: Parvinder S. Walia, Edwin Aloysius Nungesser, JR., Jack E. Hetzner
  • Patent number: 9403961
    Abstract: The present invention relates to a reactive formulation used to make a flame resistant flexible polyurethane foam which is particularly suited for use in under the hood vehicle applications. In particular, the flame resistant flexible polyurethane foam is made from a reactive formulation comprising an A side comprising (i) an organic isocyanate and a B side comprising (ii) an isocyanate-reactive component, (iii) a flame retardant component comprising a combination of red phosphorus, expandable graphite, and optionally sodium citrate wherein the resulting foam achieves a V-0 rating at 0.5 inch according to Underwriters' Laboratories Standard 94 Flammability Test.
    Type: Grant
    Filed: November 4, 2011
    Date of Patent: August 2, 2016
    Assignee: Dow Global Technologies LLC
    Inventors: F. Michael Plaver, Jack E. Hetzner
  • Patent number: 8178159
    Abstract: Silane compositions having an aromatic functionality and a ethylenically functionality and comprising a latent acid catalyst are deposited in two or more layers on a substrate. Each layer differs in light absorption properties from an adjacent layer. Some layers may have different curing mechanisms. Such a method is useful in forming antireflective coatings.
    Type: Grant
    Filed: March 31, 2004
    Date of Patent: May 15, 2012
    Inventors: Kiran K. Baikerikar, Shaoguang Feng, Jack E. Hetzner, John M. Maher, Michael E. Mills, Paul J. Popa, Richard J. Strittmatter, Larry R. Wilson
  • Patent number: 8143324
    Abstract: The use of hindered phenol containing anti-oxidants enable arylcyclobutene-based formulations to be cured in oxygen containing environments such as air without unacceptable degradation in key properties of dielectric constant, water uptake, or transmittance.
    Type: Grant
    Filed: October 12, 2005
    Date of Patent: March 27, 2012
    Assignee: Dow Global Technologies LLC
    Inventors: Ying Hung So, Edmund J. Stark, Jack E. Hetzner, Shellene K. Thurston
  • Publication number: 20110293914
    Abstract: The present invention is a method to manufacture shaped foam composite articles comprising a foam core and one or more skin and shaped foam composite articles made therefrom. Specifically, cold formed shaped foam articles having an upper and lower surface having a skin applied to one or both of the surfaces. Preferably the foam comprises a styrenic polymer foam and the skins may independently be mono-layered or multi-layered. The shaped foam article and the skin may be made from the same or different materials. In the case where there are more than one skin, the skins may comprise the same or different materials.
    Type: Application
    Filed: May 17, 2011
    Publication date: December 1, 2011
    Inventors: Myron J. Maurer, David H. Bank, Jack E. Hetzner, George A. Klumb, Matthew D. Mittag, Jason A. Reese, Alain Sagnard, Parvinder S. Walia
  • Publication number: 20100280187
    Abstract: Polyurethane and/or polyurea polymers are produced in a reaction injection molding process. The high equivalent weight isocyanate-reactive materials include a high proportion of a hydroxymethylated polyester which can be prepared using annually renewable starting materials.
    Type: Application
    Filed: August 29, 2008
    Publication date: November 4, 2010
    Inventors: Mark G. Goldhawk, Allan James, George A. Klumb, Jack E. Hetzner
  • Publication number: 20090275673
    Abstract: The use of hindered phenol containing anti-oxidants enable arylcyclobutene-based formulations to be cured in oxygen containing environments such as air without unacceptable degradation in key properties of dielectric constant, water uptake, or transmittance.
    Type: Application
    Filed: October 12, 2005
    Publication date: November 5, 2009
    Inventors: Ying Hung So, Edmund J. Stark, Jack E. Hetzner, Shellene K. Thurston
  • Patent number: 7115531
    Abstract: This invention is a method comprising providing a substrate, forming a first layer on the substrate, wherein the first layer has a dielectric constant of less than 3.0 and comprises an organic polymer, applying an organosilicate resin over the first layer, removing a portion of the organosilicate resin to expose a portion of the first layer, and removing the exposed portions of the first layer. The invention is also an integrated circuit article comprising an active substrate containing transistors and an electrical interconnect structure containing a pattern of metal lines separated, at least partially, by layers or regions of an organic polymeric material having a dielectric constant of less than 3.0 and further comprising a layer of an organosilicate resin above at least one layer of the organic polymer material.
    Type: Grant
    Filed: August 20, 2001
    Date of Patent: October 3, 2006
    Assignee: Dow Global Technologies Inc.
    Inventors: Edward O. Shaffer, II, Kevin E. Howard, Joost J. M. Waeterloos, Jack E. Hetzner, Paul H. Townsend, III, Lynne K. Mills, Sheila Gombar-Fetner, Larry R. Wilson
  • Publication number: 20040002162
    Abstract: A sample holding array is provided which is particularly advantageous for various IR and near IR transmission spectroscopy analysis that yields high quality spectra with minimal artifacts. The sample holding array may also be used desirably with slight modifications for Raman analysis, x-ray fluorescence and nanoindentation.
    Type: Application
    Filed: June 19, 2003
    Publication date: January 1, 2004
    Inventors: Mary Anne Leugers, David R. Neithamer, Jack E. Hetzner, Matthew L. Krause
  • Publication number: 20020052125
    Abstract: This invention is a method comprising providing a substrate, forming a first layer on the substrate, wherein the first layer has a dielectric constant of less than 3.0 and comprises an organic polymer, applying an organosilicate resin over the first layer, removing a portion of the organosilicate resin to expose a portion of the first layer, and removing the exposed portions of the first layer. The invention is also an integrated circuit article comprising an active substrate containing transistors and an electrical interconnect structure containing a pattern of metal lines separated, at least partially, by layers or regions of an organic polymeric material having a dielectric constant of less than 3.0 and further comprising a layer of an organosilicate resin above at least one layer of the organic polymer material.
    Type: Application
    Filed: August 20, 2001
    Publication date: May 2, 2002
    Inventors: Edward O. Shaffer, Kevin E. Howard, Joost J.M. Waeterloos, Jack E. Hetzner, Paul H. Townsend, Lynne K. Mills, Sheila Gombar-Fetner, Larry R. Wilson