Patents by Inventor Jack Helzer

Jack Helzer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11541358
    Abstract: A method for process a chemical liquid is provided. The method includes at least providing a system having at least one filtration medium, treatment the system with a treatment liquid having a content of iron (Fe) and calcium (Ca) of about 10 ppb or less, and processing a chemical liquid using an apparatus having the system configured therein after the treatment process.
    Type: Grant
    Filed: August 21, 2019
    Date of Patent: January 3, 2023
    Assignee: FUJIFILM Electronic Materials U.S.A., Inc.
    Inventors: Marcia Cole-Yocom, Bryan Hinzie, Michael Barker, Jack Helzer, Shen-Ping Huang, Pejman Ahmadiannamini, Yuan Chen
  • Patent number: 11198078
    Abstract: A chemical liquid manufacturing apparatus, including a first system and a second system, is provided. The first system includes at least one first filtration medium, selected from a first filter, a first ion exchange membrane and a first ion adsorption membrane, wherein the first system is configured to process a material of at least one time. The second system includes at least one second filtration medium, selected from a second filter, a second ion exchange membrane and a second ion adsorption membrane, wherein the second system is configured for recirculation and to process the material of at least two times.
    Type: Grant
    Filed: March 29, 2019
    Date of Patent: December 14, 2021
    Assignee: FUJIFILM Electronic Materials U.S.A., Inc.
    Inventors: Bryan Hinzie, Marcia Cole-Yocom, Michael Barker, Perry Westberg, Yuan Chen, Jack Helzer
  • Patent number: 10773210
    Abstract: The present disclosure is directed to methods of purifying solvents. The purified solvents can be used for cleaning a semiconductor substrate in a multistep semiconductor manufacturing process.
    Type: Grant
    Filed: November 15, 2019
    Date of Patent: September 15, 2020
    Assignee: Fujifilm Electronic Materials U.S.A., Inc.
    Inventors: Marcia Cole-Yocom, Bryan Hinzie, Jack Helzer, Yuan Chen, Pejman Ahmadiannamini
  • Publication number: 20200156005
    Abstract: The present disclosure is directed to methods of purifying solvents. The purified solvents can be used for cleaning a semiconductor substrate in a multistep semiconductor manufacturing process.
    Type: Application
    Filed: November 15, 2019
    Publication date: May 21, 2020
    Inventors: Marcia Cole-Yocom, Bryan Hinzie, Jack Helzer, Yuan Chen, Pejman Ahmadiannamini
  • Publication number: 20200061544
    Abstract: A method for process a chemical liquid is provided. The method includes at least providing a system having at least one filtration medium, treatment the system with a treatment liquid having a content of iron (Fe) and calcium (Ca) of about 10 ppb or less, and processing a chemical liquid using an apparatus having the system configured therein after the treatment process.
    Type: Application
    Filed: August 21, 2019
    Publication date: February 27, 2020
    Applicant: FUJIFILM Electronic Materials U.S.A., Inc.
    Inventors: Marcia Cole-Yocom, Bryan Hinzie, Michael Barker, Jack Helzer, Shen-Ping Huang, Pejman Ahmadiannamini, Yuan Chen
  • Publication number: 20190308117
    Abstract: A chemical liquid manufacturing apparatus, including a first system and a second system, is provided. The first system includes at least one first filtration medium, selected from a first filter, a first ion exchange membrane and a first ion adsorption membrane, wherein the first system is configured to process a material of at least one time. The second system includes at least one second filtration medium, selected from a second filter, a second ion exchange membrane and a second ion adsorption membrane, wherein the second system is configured for recirculation and to process the material of at least two times.
    Type: Application
    Filed: March 29, 2019
    Publication date: October 10, 2019
    Applicant: FUJIFILM Electronic Materials U.S.A., Inc.
    Inventors: Bryan Hinzie, Marcia Cole-Yocom, Michael Barker, Perry Westberg, Yuan Chen, Jack Helzer