Patents by Inventor Jack Hui He

Jack Hui He has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PROCESSOR COOLING WITH PHASE CHANGE MATERIAL FILLED SHELL
    Publication number: 20230100966
    Abstract: A processor cooling system may include a processor, a shell having an interior thermally coupled to the processor to receive heat from the processor and a mass of solid to liquid (STL) phase change material filling the shell.
    Type: Application
    Filed: December 3, 2019
    Publication date: March 30, 2023
    Inventors: Robert Lee CRANE, Andrew L. WILTZIUS, Jack Hui HE
  • ANTI-COUNTERFEITING
    Publication number: 20200223114
    Abstract: One example includes an injection-molded component comprising a surface surrounded by peripheral edges and which is formed via an injection-molding process. The surface includes a three-dimensional surface feature to render the surface as being non-planar across at least a portion of the surface. The surface also includes a plurality of holographic micro-features formed across the surface and being to interact with ambient light to provide a holographic image corresponding to an authentication mark associated with the injection-molded component.
    Type: Application
    Filed: January 30, 2017
    Publication date: July 16, 2020
    Inventors: Adolfo Gomez, William E. Gallahan, Jack Hui He
  • Three-dimensional model generation
    Patent number: 10380792
    Abstract: Examples associated with three-dimensional model generation are disclosed. One example includes analyzing a structure of a first component of an object. The composition of the first component of the object is also analyzed. A three-dimensional model of the object is then generated. The three-dimensional model includes data based on the structure of the first component of the object and data based on the composition of the first component of the object.
    Type: Grant
    Filed: September 30, 2015
    Date of Patent: August 13, 2019
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Jack Hui He, Paul Howard Mazurkiewicz, Hang-Yan Yuen
  • THREE-DIMENSIONAL MODEL GENERATION
    Publication number: 20180197328
    Abstract: Examples associated with three-dimensional model generation are disclosed. One example includes analyzing a structure of a first component of an object. The composition of the first component of the object is also analyzed. A three-dimensional model of the object is then generated. The three-dimensional model includes data based on the structure of the first component of the object and data based on the composition of the first component of the object.
    Type: Application
    Filed: September 30, 2015
    Publication date: July 12, 2018
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Jack Hui He, Paul Howard Mazurkiewicz, Hang-Yan Yuen