Patents by Inventor Jack J. Chen

Jack J. Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5590374
    Abstract: An interface controller for an addressable interface module. The interface module is for coupling along with other addressable interface modules over a communication bus to a central processor. Each interface module responds to a unique base address, unique to such interface module provided by the central processor on the communication bus, responsive either to a read command for reading data from such interface module to the communication bus or to a write command for writing data from the communication bus to such interface module. A stored configuration base address is provided in the interface controller for use in determining the unique address for which the corresponding interface module is to respond. A decoder in the interface controller decodes the base address including a modified configuration address for use by the corresponding interface module in determining the unique address for response by the corresponding interface module.
    Type: Grant
    Filed: January 30, 1996
    Date of Patent: December 31, 1996
    Assignee: Fujitsu Limited
    Inventors: Ryan E. Shariff, Gerald Moseley, Jack J. Chen, Wen-Feng Chang, Fazal Abbas
  • Patent number: 5537742
    Abstract: There is provided a method for joining the buss wires of a pair of flexible cables by splicing and encapsulating the ends of the cables together. This method involves the splicing of the two cables together by stripping oppositely disposed ends of the two cables such that the buss wires are left exposed. The exposed wires are inserted into respective ends of a connector tube formed of a material having a similar melting point, tensile strength and electrical conductivity properties to the buss wires disposed therein. Both ends of the connector tube are then welded to the oppositely disposed buss wires. Thereafter, the welded wires are encapsulated within an polymer encapsulation layer which overlaps with portions of the flexible sheath that had not been stripped. The polymer encapsulation layer is preferably one which exhibits a similar melting point and tensile strength to the flexible polymer sheath.
    Type: Grant
    Filed: May 22, 1995
    Date of Patent: July 23, 1996
    Assignee: General Signal Corporation
    Inventors: Huu V. Le, Michael W. Farslow, Jack J. Chen, Michael S. Yarnall