Patents by Inventor Jack L. Goodman

Jack L. Goodman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Assembly for dissipatating heat from a semiconductor chip wherein a stress on the semiconductor chip due to a thermally conductive member is partially relieved
    Patent number: 5920120
    Abstract: An assembly comprising a substrate, a thermally conductive member which is spaced from the substrate, and a semiconductor chip located on a side of the substrate facing the thermally conductive member. A resilient component is compressed between the substrate and the thermally conductive member so that a force clamping the substrate and the thermally conductive member together is shared by at least the semiconductor chip and the component.
    Type: Grant
    Filed: December 19, 1997
    Date of Patent: July 6, 1999
    Assignee: Intel Corporation
    Inventors: James S. Webb, Jack L. Goodman, Nadir Sharaf, Lawrence E. McKay