Patents by Inventor Jack L. Metz

Jack L. Metz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11978799
    Abstract: A method of fabricating a MOS transistor having a thinned channel region is described. The channel region is etched following removal of a dummy gate. The source and drain regions have relatively low resistance with the process.
    Type: Grant
    Filed: January 13, 2021
    Date of Patent: May 7, 2024
    Assignee: Tahoe Research, Ltd.
    Inventors: Justin K. Brask, Robert S. Chau, Suman Datta, Mark L. Doczy, Brian S. Doyle, Jack T. Kavalieros, Amlan Majumdar, Matthew V. Metz, Marko Radosavljevic
  • Patent number: 4892531
    Abstract: A sleeve-like element having at least one opening in a wall to permit the flow of body wastes from a stoma to a pouch while preventing a wall of the pouch from blocking the discharge end of said stoma. Said sleeve-like element protects the stoma from accidental external forces and allows a user to firm up the critical adhesive area surrounding the stoma following the attachment and assembly of the system. The sleeve-like element is readily cleanable for re-use.
    Type: Grant
    Filed: September 11, 1987
    Date of Patent: January 9, 1990
    Assignee: Florence Metz
    Inventors: Jack L. Metz, deceased, by Florence Metz, executrix
  • Patent number: 3998377
    Abstract: A method of and apparatus for bonding together a first and a second workpiece, which are bondable by applying energy thereto while they are urged together at a bonding site. First, the workpieces are urged together by moving into engagement with the first workpiece, and then slightly deforming, a rigid, self-supporting, deformable planar member. The deformation is not only effective to urge the workpieces together, but also forms a capillary space between the member and the first workpiece. Then, the energy is passed to the bonding site. If the energy should produce, molten components at the site, they are attracted into the capillary space to prevent them from creeping up the workpieces and from undesirably building up at the bond site. Multiple pairs of workpieces may be simultaneously bonded by overlying all of the bonding sites with the member and by deforming it by the application of a force at a point generally central to all of the bonding sites.
    Type: Grant
    Filed: March 29, 1976
    Date of Patent: December 21, 1976
    Assignee: Teletype Corporation
    Inventor: Jack L. Metz