Patents by Inventor Jack Linn

Jack Linn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Plasma Enhanced Deposited, Fully Oxidized PSG Film
    Publication number: 20070187803
    Abstract: A method of forming a plasma enhanced deposited oxide film on a substrate includes introducing into a chamber containing the substrate silane gas and a dopant gas such as phosphine. The chamber is pressurized and energy is applied to create a plasma. The energy may be a dual frequency energy. The gas rates and pressure are selected to produce a plasma enhanced deposited oxide film on a substrate having a Si—O—Si bond peak absorbance in the IR spectrum of at least 1092 cm?1.
    Type: Application
    Filed: April 25, 2007
    Publication date: August 16, 2007
    Applicant: INTERSIL AMERICAS INC.
    Inventors: Katie Pentas, Mark Bordelon, Jack Linn
  • Plasma enhanced deposited, fully oxidized PSG film
    Publication number: 20060001127
    Abstract: A method of forming a plasma enhanced deposited oxide film on a substrate includes introducing into a chamber containing the substrate silane gas and a dopant gas such as phosphine. The chamber is pressurized and energy is applied to create a plasma. The energy may be a dual frequency energy. The gas rates and pressure are selected to porduce a plasma enhanced deposited oxide film on a substrate having a Si—O—Si bond peak absorbance in the IR spectrum of at least 1092 cm?1.
    Type: Application
    Filed: September 30, 2004
    Publication date: January 5, 2006
    Inventors: Katie Pentas, Mark Bordelon, Jack Linn
  • Inverted thin film resistor and method of manufacture
    Patent number: 6121105
    Abstract: An integrated circuit inverted thin film resistor structure and method of manufacture having interconnect defining resistor contacts and leads resident within and coplanar with a supporting layer, resistive material uniformly overlaying the supporting layer and contacts, the resistive material diffused into the resistor/interconnect contact region.
    Type: Grant
    Filed: October 29, 1999
    Date of Patent: September 19, 2000
    Assignee: Intersil Corporation
    Inventors: William R. Wade, Jack Linn
  • Inverted thin film resistor
    Patent number: 6034411
    Abstract: An integrated circuit inverted thin film resistor structure and method of manufacture having interconnect defining resistor contacts and leads resident within and coplanar with a supporting layer, resistive material uniformly overlaying the supporting layer and contacts, the resistive material diffused into the resistor/interconnect contact region.
    Type: Grant
    Filed: October 29, 1997
    Date of Patent: March 7, 2000
    Assignee: Intersil Corporation
    Inventors: William R. Wade, Jack Linn
  • Multilayer microtip probe and method
    Patent number: 5892223
    Abstract: A multilayer microtip probe, and method of manufacture, having a microtip prepared for adhesion of a first overlayer for determining probe operating properties and a hardened protective overlayer for improving resistance to erosion and wear during probe use.
    Type: Grant
    Filed: June 30, 1997
    Date of Patent: April 6, 1999
    Assignee: Harris Corporation
    Inventors: Elijah Karpov, Jack Linn, Richard Belcher
  • Diamond insulator devices and method of fabrication
    Patent number: 5683939
    Abstract: Semiconductor device and circuits and methods of fabrication which provides multilevel interconnections with grown diamond insulation films and second level resistors in the diamond insulation. The diamond provides both good electrical insulation and good thermal conductivity. The methods also provide capacitors with second level diamond dielectrics.
    Type: Grant
    Filed: June 6, 1995
    Date of Patent: November 4, 1997
    Assignee: Harris Corporation
    Inventors: Gregory Schrantz, Jack Linn, Richard Belcher