Patents by Inventor Jack Monjay Yao

Jack Monjay Yao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Statistical integrated circuit package modeling for analysis at the early design age
    Patent number: 8225258
    Abstract: In designing an integrated circuit on a die having a set of die bumps, a method to generate a set of lumped circuit parameter values associated with the set of die bumps, based upon distances between the set of die bumps and the center of the die, the method also based upon a sample-data distribution function of a die bump distance variable and a sample-data distribution function of a lumped circuit parameter variable. Other embodiments are described and claimed.
    Type: Grant
    Filed: June 11, 2009
    Date of Patent: July 17, 2012
    Assignee: QUALCOMM Incorporated
    Inventors: Xiaoming Chen, Jack Monjay Yao
  • Statistical Integrated Circuit Package Modeling For Analysis At The Early Design Age
    Publication number: 20100318955
    Abstract: In designing an integrated circuit on a die having a set of die bumps, a method to generate a set of lumped circuit parameter values associated with the set of die bumps, based upon distances between the set of die bumps and the center of the die, the method also based upon a sample-data distribution function of a die bump distance variable and a sample-data distribution function of a lumped circuit parameter variable. Other embodiments are described and claimed.
    Type: Application
    Filed: June 11, 2009
    Publication date: December 16, 2010
    Applicant: QUALCOMM INCORPORATED
    Inventors: Xiaoming Chen, Jack Monjay Yao