Abstract: A system configured to increase a reliability of electrical connections in a device. The system including a lead configured to electrically connect a pad of at least one support structure to a pad of at least one electrical component. The lead includes an upper portion that includes a lower surface arranged on a lower surface thereof. The lower surface of the upper portion is arranged vertically above a first upper surface of a first pad connection portion; and the lower surface of the upper portion is arranged vertically above a second upper surface of the second pad connection portion. A process configured to increase a reliability of electrical connections in a device is also disclosed.

Abstract: A system configured to increase a reliability of electrical connections in a device. The system including a lead configured to electrically connect a pad of at least one support structure to a pad of at least one electrical component. The lead includes an upper portion that includes a lower surface arranged on a lower surface thereof. The lower surface of the upper portion is arranged vertically above a first upper surface of a first pad connection portion; and the lower surface of the upper portion is arranged vertically above a second upper surface of the second pad connection portion. A process configured to increase a reliability of electrical connections in a device is also disclosed.

Abstract: A system configured to increase a reliability of electrical connections in a device. The system including a lead configured to electrically connect a pad of at least one support structure to a pad of at least one electrical component. The lead includes an upper portion that includes a lower surface arranged on a lower surface thereof. The lower surface of the upper portion is arranged vertically above a first upper surface of a first pad connection portion; and the lower surface of the upper portion is arranged vertically above a second upper surface of the second pad connection portion. A process configured to increase a reliability of electrical connections in a device is also disclosed.

Abstract: A system configured to increase a reliability of electrical connections in a device. The system including a lead configured to electrically connect a pad of at least one support structure to a pad of at least one electrical component. The lead includes an upper portion that includes a lower surface arranged on a lower surface thereof. The lower surface of the upper portion is arranged vertically above a first upper surface of a first pad connection portion; and the lower surface of the upper portion is arranged vertically above a second upper surface of the second pad connection portion. A process configured to increase a reliability of electrical connections in a device is also disclosed.

Abstract: The present invention provides an amplifier arrangement to which feed forward correction is applied by a comparison loop including comparison means for comparing amplifier input with amplifier output to provide an error signal, a cancellation loop including secondary amplifier means for amplifying the error signal and combining means for combining said amplified signal with said amplifier output, a pilot generator coupled to said amplifier input to introduce a pilot tone therein, detector means for detecting a level of pilot tone in said amplifier output and correction means for correcting said cancellation loop performance as a function of said detection wherein said pilot generator is further coupled to a multiplier receiving said amplifier output, said multiplier producing an output signal arranged to control a loop parameter to effect said correction.

Abstract: A r.f. wideband high power amplifier (1) receives an input signal at its input via a coupler (7) whenever a signal for amplification is applied to an input port (15). The output of the amplifier (1) is tapped by a coupler (8) and fed to an input of a comparator (3). The input signal applied at the input port (15) is fed to a second input of the comparator (3) via a delay line (5), arranged to introduce a delay substantially equal to that of the power amplifier (1). The comparator (3) produces at its output an error signal representative of the difference between the input signal fed via the amplified and the delayed path. A combiner (16) serves to introduce the amplified error signal to the amplifier output signal such that the error signal is in anti-phase therewith. Thus, the resultant signal produced at an output port (4) has had feed forward distortion cancellation.

Abstract: In order to improve the distortion performance of a feed forward corrected amplifier, an amplifier arrangement includes a distortion generator (312) which is coupled between an input (15) and a main amplifier (1). The amplifier arrangement is such that the input signal passes to the distortion generator (312) via a coupler (307). The signal passes via a delay network (310) which compensates for the delay of the distortion generator (312) and is tapped by a coupler (308) to be combined by a coupler (313) with the distorted signal from the distortion generator (312). In this way the output of the distortion generator is subtracted from a sample of the input signal so that only the distortion remains to pass via phase (314) and amplitude (315) correction networks to be amplifier by a gain element (316) before being coupled back into the main signal path by a coupler (309). The correction is active over a portion of the main amplifier characteristics such as the compression region of the main amplifier.

Abstract: A packaging technique for radio-frequency circuits, such as feed-forward amplifiers, in which a single ground plane is formed between active components of the circuit and a circuit board bearing passive components of the circuit. The ground plane comprises a metallized face of the circuit board and a metal heat sink attached to each active component. The assembly, including the circuit board, heat sinks and active and passive components, is supported on a ledge in the walls of a metal housing, such that heat is conducted laterally through the ground plane and directly into the walls of the housing. The walls of the housing, including an intermediate wall between active amplifier components, also serve to isolate the active components from each other and from the environment. The plane also serves to isolate the active components from the passive ones.

Abstract: A feed-forward amplifier having delay lines formed as microstrip transmission lines, for reliability and low losses, and signal amplifiers that have phase linearity, to match the delay lines, and a relatively high gain. The resulting device can be manufactured more reliably at relatively low cost, but has improved error cancellation performance, improved temperature stability, and is simple to tune after assembly, without removal of components.